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    • 3. 发明申请
    • WAFER LEVEL SEALING METHODS WITH DIFFERENT VACUUM LEVELS FOR MEMS SENSORS
    • 用于MEMS传感器的不同真空度的水平密封方法
    • US20150091153A1
    • 2015-04-02
    • US14041298
    • 2013-09-30
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yu-Chia LiuChia-Hua ChuKuei-Sung ChangChun-Wen Cheng
    • B81C1/00B81B7/00
    • B81C1/00293B81B3/0018B81B3/0059B81B3/0067B81B7/0032B81B7/0041B81B7/02B81C1/00158B81C2203/0145H01L29/84
    • The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the work-piece in a first ambient environment having a first pressure. The bonding forms a plurality of cavities abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of cavities leading to a gas flow path that could be held at a pressure level different from the first pressure. The one or more openings in the one or more of the plurality of cavities are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of cavities to be held at the different pressure.
    • 本公开涉及一种在晶片封装系统上形成具有多个具有不同压力的空腔的多个MEM器件的方法,以及相关联的装置。 在一些实施例中,该方法通过提供具有多个微机电系统(MEM)装置的工件来执行。 帽盖晶片在具有第一压力的第一周围环境中结合到工件上。 接合形成与多个保持在第一压力下的多个MEM装置邻接的多个空腔。 一个或多个开口形成在多个空腔中的一个或多个空腔中,导致可以保持在不同于第一压力的压力水平的气体流动路径。 然后将多个空腔中的一个或多个中的一个或多个开口密封在具有不同压力的不同周围环境中,从而使多个空腔中的一个或多个保持在不同的压力。
    • 10. 发明授权
    • Hysteretic MEMS thermal device and method of manufacture
    • 迟滞MEMS热装置及其制造方法
    • US07944113B2
    • 2011-05-17
    • US12318634
    • 2009-01-05
    • Paul J. Rubel
    • Paul J. Rubel
    • H01L41/08
    • F03G7/06B81B3/0059B81B2201/018B81B2201/032B81B2201/054H01H61/02H01H61/04H01H2001/0047H01H2001/0068H01H2061/006H01H2061/008H02N10/00Y10T29/49105
    • A MEMS hysteretic thermal actuator may have a plurality of beams disposed over a heating element formed on the surface of the substrate. The plurality of beams may be coupled to a passive beam which is not disposed over the heating element. One of the plurality of beams may be formed in a first plane parallel to the substrate, whereas another of the plurality of beams may be formed in a second plane closer to the surface of the substrate. When the heating element is activated, it heats the plurality of beams such that they move the passive beam in a trajectory that is neither parallel to nor perpendicular to the surface of the substrate. When the beams are cooled, they may move in a different trajectory, approaching the substrate before moving laterally across it to their initial positions. By providing one electrical contact on the distal end of the passive beam and another stationary electrical contact on the substrate surface, the MEMS hysteretic actuator may form a reliable electrical switch that is relatively simple to manufacture and operate.
    • MEMS迟滞热致动器可以具有设置在形成在基板的表面上的加热元件上的多个光束。 多个光束可以耦合到未设置在加热元件上方的无源光束。 多个光束中的一个可以形成在平行于衬底的第一平面中,而多个光束中的另一个可以形成在靠近衬底表面的第二平面中。 当加热元件被激活时,它加热多个光束,使得它们以不平行于或垂直于衬底表面的轨迹移动被动束。 当梁被冷却时,它们可以以不同的轨迹移动,在横向移动到其初始位置之前接近基板。 通过在被动束的远端上提供一个电接触,并在衬底表面上提供另一个固定的电触点,MEMS滞后致动器可形成可靠的电开关,其制造和操作相对简单。