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    • 22. 发明申请
    • THIN FILM PIEZOELECTRIC BULK ACOUSTIC WAVE RESONATOR AND RADIO FREQUENCY FILTER USING THE SAME
    • 薄膜压电体积波形谐振器和无线电频率滤波器
    • US20080024042A1
    • 2008-01-31
    • US11627858
    • 2007-01-26
    • Atsushi IsobeKengo AsaiHisanori MatsumotoNobuhiko Shibagaki
    • Atsushi IsobeKengo AsaiHisanori MatsumotoNobuhiko Shibagaki
    • H01L41/047
    • H03H9/02228H03H3/04H03H9/173H03H9/175H03H9/564H03H9/568H03H9/605H03H2003/0428H03H2003/0457H03H2003/0471
    • An object of the present invention is to provide an inexpensive thin film piezoelectric bulk acoustic wave resonator that allows fine-tuning of a resonant frequency. Another object is to provide an inexpensive filter with dramatically improved frequency characteristics, using thin film piezoelectric bulk acoustic wave resonators that can be formed on one substrate. A thin film piezoelectric bulk acoustic wave resonator of the present invention has a laminated structure including a piezoelectric thin film, and a first metal electrode film and a second metal electrode film between which part of the piezoelectric thin film is sandwiched; the first metal electrode film has a plurality of holes formed on an electrode plane opposite to the second metal electrode film and having a depth equivalent to at least the thickness of the first metal electrode film; and if a combined thickness of top and bottom electrode layers and the piezoelectric thin film is ht, the covering ratio σ of the electrode plane of the first metal electrode film satisfies a condition 0
    • 本发明的目的是提供一种廉价的薄膜压电体声波谐振器,其允许谐振频率的微调。 另一个目的是提供一种具有显着改善的频率特性的便宜的滤波器,使用可以在一个基板上形成的薄膜压电体声波谐振器。 本发明的薄膜压电体声波谐振器具有包括压电薄膜和第一金属电极薄膜和第二金属电极薄膜的叠层结构,压电薄膜的一部分夹在其间; 所述第一金属电极膜具有形成在与所述第二金属电极膜相反的电极面上并且具有至少等于所述第一金属电极膜的厚度的深度的多个孔; 并且如果顶部和底部电极层和压电薄膜的组合厚度为ht,则对于每1.28ht间距,第一金属电极膜的电极平面的覆盖比sigma满足条件0 <σ<1。
    • 23. 发明授权
    • RF-MEMS switch and its fabrication method
    • RF-MEMS开关及其制造方法
    • US07242273B2
    • 2007-07-10
    • US10902573
    • 2004-07-30
    • Atsushi IsobeAkihisa TeranoKengo AsaiHiroyuki UchiyamaHisanori Matsumoto
    • Atsushi IsobeAkihisa TeranoKengo AsaiHiroyuki UchiyamaHisanori Matsumoto
    • H01H51/22
    • H01H59/0009H01H1/20H01P1/127
    • The MEMS switch comprises a first anchor formed over a substrate, a first spring connected to the first anchor, an upper electrode which is connected to the first spring and makes a motion above the substrate, elastically deforming the first spring, a lower electrode formed over the substrate, positioned under the upper electrode, a second spring connected to the upper electrode, and a second anchor connected to the second spring. When voltage is applied between the upper and lower electrodes and the upper electrode makes a downward motion, the second anchor is brought into contact with the substrate. As a result, the second spring is elastically deformed. When the upper electrode is subsequently brought into contact with the lower electrode, thereby the upper and lower electrodes are electrically connected. The first and second anchors, first and second springs, and upper electrode are formed of identical metal in integral structure.
    • MEMS开关包括形成在衬底上的第一锚,连接到第一锚的第一弹簧,连接到第一弹簧并在衬底上方进行运动的上电极,使第一弹簧弹性变形, 位于上电极下方的基板,连接到上电极的第二弹簧和连接到第二弹簧的第二锚固件。 当在上下电极之间施加电压并且上电极向下运动时,使第二锚与基板接触。 结果,第二弹簧弹性变形。 当上电极随后与下电极接触时,上电极和下电极电连接。 第一和第二锚固件,第一和第二弹簧以及上部电极由整体结构相同的金属形成。
    • 24. 发明授权
    • Bulk acoustic wave resonator and manufacturing method thereof, filter using the same, semiconductor integrated circuit device using the same, and high frequency module using the same
    • 体声波谐振器及其制造方法,使用其的滤波器,使用其的半导体集成电路器件,以及使用其的高频模块
    • US07221242B2
    • 2007-05-22
    • US11067374
    • 2005-02-28
    • Kengo AsaiHisanori MatsumotoAtsushi IsobeMitsutaka Hikita
    • Kengo AsaiHisanori MatsumotoAtsushi IsobeMitsutaka Hikita
    • H03H9/00H01L41/00
    • H03H3/02H03H9/0542H03H9/0571H03H9/174H03H9/564H03H9/706
    • A bulk acoustic wave resonator in which the problem of the technology for forming the diaphragm structure is resolved, which is more compact and improved the frequency accuracy, and the manufacturing method thereof, a filter using the same, a semiconductor integrated circuit device using the same, and a high frequency module using the same are provided. The bulk acoustic wave resonator according to the present invention comprises a substrate having a first surface and a second surface opposite to the first surface, and a staked resonator including a first electrode film in contact with the first surface, a piezoelectric film overlaying the first electrode film and a second electrode film overlaying the piezoelectric film. The substrate is provided with an air gap including a first aperture opening at the first surface and a second aperture opening at the second surface at the position corresponding to the staked resonator, respectively and having air gap generally vertical shape to the first surface, and another air gap having a tapered shape in the vicinity of the first surface.
    • 解决了用于形成隔膜结构的技术的问题的体声波谐振器,其更紧凑并且提高了频率精度,其制造方法,使用该隔膜结构的滤波器,使用该隔膜结构的半导体集成电路器件 ,并且提供使用该模块的高频模块。 根据本发明的体声波谐振器包括具有与第一表面相对的第一表面和第二表面的基板,以及包括与第一表面接触的第一电极膜的支架谐振器,覆盖第一电极的压电膜 膜和覆盖压电膜的第二电极膜。 衬底设置有气隙,该空气间隙包括在第一表面处的第一孔径开口和位于对应于桩状共振器的位置处的第二表面处的第二孔口开口,并且具有大致垂直于第一表面的气隙,另一个 气隙在第一表面附近具有锥形形状。
    • 29. 发明申请
    • Thin-Film Piezoelectric Acoustic Wave Resonator and High-Frequency Filter
    • 薄膜压电声波谐振器和高频滤波器
    • US20110304243A1
    • 2011-12-15
    • US13201344
    • 2010-02-18
    • Atsushi IsobeKengo Asai
    • Atsushi IsobeKengo Asai
    • H01L41/04
    • H03H9/173H03H9/564H03H9/568H03H9/587H03H9/605
    • A thin-film piezoelectric acoustic wave resonator that has a large k2, can trap acoustic energy in a resonating part, does not excite spurious resonance, or can finely adjust resonance frequency and a high-frequency filter using the thin-film piezoelectric acoustic wave resonator are provided without increasing the number of processes. At both ends of a vibrating part (1), fixing parts (8) are physically connected, and between the vibrating part (1) and each of the fixing parts (8), an acoustic insulating part (10) and a phase rotating part (11) are physically connected. As with the vibrating part (1), the acoustic insulating part (10) and the phase rotating part (11) are made up of an upper metal film (3), a piezoelectric thin film, and a lower metal film, and an acoustic wave reflector (6) is provided on each of an upper surface, a lower surface, and side surfaces of the vibrating part (1), the acoustic insulating part (10), and the phase rotating part (11). The vibrating part (1) has a width smaller than its length (La) and also smaller than its thickness, and width/thickness is smaller than 1.
    • 具有大k2的薄膜压电声波谐振器可以捕获谐振部分中的声能,不会激发寄生谐振,或者可以使用薄膜压电声波谐振器来微调谐谐振频率和高频滤波器 在不增加处理次数的情况下被提供。 在振动部件(1)的两端,固定部件(8)物理连接,并且在振动部件(1)和每个固定部件(8)之间,隔音部件(10)和相转动部件 (11)物理连接。 与振动部件(1)一样,隔音部件(10)和相位旋转部件(11)由上部金属膜(3),压电薄膜和下部金属膜构成,声学 波形反射器(6)设置在振动部分(1),隔音部分(10)和相位旋转部分(11)的上表面,下表面和侧表面中的每一个上。 振动部件(1)的宽度比其长度(La)小,也比其厚度小,宽度/厚度小于1。