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    • 3. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20130009289A1
    • 2013-01-10
    • US13617483
    • 2012-09-14
    • Yasuyuki ARAIYuko TACHIMURAYohei KANNOMai AKIBA
    • Yasuyuki ARAIYuko TACHIMURAYohei KANNOMai AKIBA
    • H01L23/66
    • H01L27/1266G06K19/025G06K19/07728G06K19/07749H01L27/1214H01L27/13H01L2221/6835H01L2224/73204
    • An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.
    • 本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。 半导体器件包括夹在第一和第二密封膜之间的集成电路,与集成电路电连接的天线,夹在基板和集成电路之间的第一密封膜,其包括多个第一绝缘膜和至少一个第二绝缘膜 夹在其间的绝缘膜,所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。 第二绝缘膜具有比第一绝缘膜低的应力,并且第四绝缘膜具有比第三绝缘膜更低的应力。 第一和第三绝缘膜是无机绝缘膜。
    • 4. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US08289164B2
    • 2012-10-16
    • US12846104
    • 2010-07-29
    • Shunpei YamazakiJun KoyamaMai Akiba
    • Shunpei YamazakiJun KoyamaMai Akiba
    • G08B13/14
    • H01L27/1266H01L27/1214H01L27/1218H01L29/78603Y10T29/49117
    • A semiconductor device typified by a wireless tag, which has improved mechanical strength, can be formed by a more simple process at a low cost and prevent radio waves from being shielded, and a manufacturing method of the semiconductor device. According to the invention, a wireless tag includes a thin film integrated circuit formed of an isolated TFT having a thin film semiconductor film. The wireless tag may be attached directly to an object, or attached to a flexible support such as plastic and paper before being attached to an object. The wireless tag of the invention may include an antenna as well as the thin film integrated circuit. The antenna allows to communicate signals between a reader/writer and the thin film integrated circuit, and to supply a power source voltage from the reader/writer to the thin film integrated circuit.
    • 可以通过更简单的方法以低成本的方法形成具有改善的机械强度的无线标签代表的半导体器件,并且防止无线电波被屏蔽,以及半导体器件的制造方法。 根据本发明,无线标签包括由具有薄膜半导体膜的隔离TFT形成的薄膜集成电路。 无线标签可以在被附接到对象之前直接附着到物体上,或者附着到诸如塑料和纸张之类的柔性支撑件上。 本发明的无线标签可以包括天线以及薄膜集成电路。 该天线允许在读/写器和薄膜集成电路之间通信信号,并将读取器/写入器的电源电压提供给薄膜集成电路。
    • 8. 发明申请
    • LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 发光装置及其制造方法
    • US20110233557A1
    • 2011-09-29
    • US13108021
    • 2011-05-16
    • Shunpei YAMAZAKIToru TAKAYAMAMai AKIBA
    • Shunpei YAMAZAKIToru TAKAYAMAMai AKIBA
    • H01L33/16
    • H01L51/0097H01L27/3244H01L27/326H01L51/5237H01L51/5253H01L51/5256H01L51/529H01L51/56H01L2221/68368H01L2227/326H01L2251/5315H01L2251/5338
    • The present invention has an object of providing a light emitting device including an OLED formed on a plastic substrate, which can prevent the degradation due to penetration of moisture or oxygen. On a plastic substrate, a plurality of films for preventing oxygen or moisture from penetrating into an organic light emitting layer in the OLED (hereinafter, referred to as barrier films) and a film having a smaller stress than that of the barrier films (hereinafter, referred to as a stress relaxing film), the film being interposed between the barrier films, are provided. Owing to a laminate structure of a plurality of barrier films, even if a crack occurs in one of the barrier films, the other barrier film(s) can effectively prevent moisture or oxygen from penetrating into the organic light emitting layer. Moreover, the stress relaxing film, which has a smaller stress than that of the barrier films, is interposed between the barrier films, thereby making it possible to reduce a stress of the entire sealing film. As a result, a crack due to stress hardly occurs.
    • 本发明的目的是提供一种发光装置,其包括形成在塑料基板上的OLED,其能够防止由于水分或氧气的渗透而导致的劣化。 在塑料基板上,用于防止氧或水分渗入OLED中的有机发光层的多个膜(以下称为阻挡膜)和具有比阻挡膜的应力小的膜(以下称为“ 被称为应力缓和膜),膜被插入在阻挡膜之间。 由于多个阻挡膜的层压结构,即使在一个阻挡膜中发生裂纹,另一个阻挡膜可以有效地防止水分或氧气渗入有机发光层。 此外,在阻挡膜之间插入有比阻挡膜小的应力的应力缓和膜,从而可以减小整个密封膜的应力。 结果,几乎不发生由于应力引起的裂纹。
    • 9. 发明授权
    • Inspection system, inspection method, and method for manufacturing semiconductor device
    • 检测系统,检验方法及制造半导体器件的方法
    • US07667454B2
    • 2010-02-23
    • US12326623
    • 2008-12-02
    • Yasuyuki AraiYuko TachimuraMai Akiba
    • Yasuyuki AraiYuko TachimuraMai Akiba
    • H01L21/00H01L21/66H01L31/84
    • G01R31/2889G01R31/2886G01R31/3025G01R31/303G06K7/0095
    • The present invention provides an inspection system of ID chips that can supply a signal or power supply voltage to an ID chip without contact, and can increase throughput of an inspection process and an inspection method using the inspection system. The inspection system according to the present invention includes a plurality of inspection electrodes, a plurality of inspection antennas, a position control unit, a unit for applying voltage to each of the inspection antennas, and a unit for measuring potentials of the inspection electrodes. One feature of the inspection system is that a plurality of ID chips and the plurality of inspection electrodes are overlapped with a certain space therebetween, and the plurality of ID chips and the plurality of inspection antennas are overlapped with a certain space therebetween, and the plurality of ID chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by the position control unit.
    • 本发明提供一种可以向ID芯片提供信号或电源电压而不接触的ID芯片的检查系统,并且可以增加检查过程的吞吐量和使用该检查系统的检查方法。 根据本发明的检查系统包括多个检查电极,多个检查天线,位置控制单元,向每个检查天线施加电压的单元和用于测量检查电极的电位的单元。 检查系统的一个特征在于,多个ID芯片和多个检查电极在其间具有一定的间隔重叠,并且多个ID芯片和多个检查天线在它们之间以一定的间隔重叠,并且多个 的ID芯片通过位置控制单元插入在多个检查电极和多个检查天线之间。