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1. 发明授权

US5536293A Base metal composition for external electrode of multilayer electronic component 失效
标题翻译：多层电子元件外部电极基体金属组成
公开(公告)号：US5536293A
公开(公告)日：1996-07-16
申请号：US318186
申请日：1994-10-05
申请人： Mika Yamamoto , Masaki Fujiyama , Yukio Sanada , Kunihiko Hamada
发明人： Mika Yamamoto , Masaki Fujiyama , Yukio Sanada , Kunihiko Hamada
IPC分类号： H01B1/02 , C03C8/18 , C22C32/00 , H01B1/16 , H01G4/232 , H01L23/498 , C22C9/04
CPC分类号： H01G4/2325 , C03C8/18 , C22C32/0089 , H01B1/16 , H01L23/49883 , H01L2924/0002 , H01L2924/09701
摘要： A base metal composition for forming an external electrode of a multilayer electronic component contains 70 to 85 percent by weight of Cu, 2 to 10 percent by weight of glass frit and 10 to 28 percent by weight of an organic vehicle. The glass frit contains at least one of lead zinc borosilicate and zinc borosilicate, Ba-Si based glass, and Zn which is in a range of less than 10 percent by weight in terms of ZnO.
摘要翻译：用于形成多层电子部件的外部电极的贱金属组合物含有70〜85重量％的Cu，2〜10重量％的玻璃料和10〜28重量％的有机载体。玻璃料包含硼硅酸铅锌和硼硅酸锌，Ba-Si基玻璃和Zn中的至少一种，其以ZnO计小于10重量％的范围。

2. 发明授权

US06197221B1 Electrically conductive paste and electronic element 有权
公开(公告)号：US06197221B1
公开(公告)日：2001-03-06
申请号：US09262572
申请日：1999-03-04
申请人： Yukio Sanada , Hiromasa Takahashi , Shinichiro Kuroiwa , Masaki Fujiyama , Kunihiko Hamada , Akira Otani
发明人： Yukio Sanada , Hiromasa Takahashi , Shinichiro Kuroiwa , Masaki Fujiyama , Kunihiko Hamada , Akira Otani
IPC分类号： H01B106
CPC分类号： H01G4/0085 , H01B1/16
摘要： An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90° or less as measured in a nitrogen atmosphere.

3. 发明授权

US06585916B2 Electrically conductive paste and electronic element 有权
标题翻译：导电胶和电子元件
公开(公告)号：US06585916B2
公开(公告)日：2003-07-01
申请号：US09757861
申请日：2001-01-10
申请人： Yukio Sanada , Hiromasa Takahashi , Shinichiro Kuroiwa , Masaki Fujiyama , Kunihiko Hamada , Akira Otani
发明人： Yukio Sanada , Hiromasa Takahashi , Shinichiro Kuroiwa , Masaki Fujiyama , Kunihiko Hamada , Akira Otani
IPC分类号： H01B102
CPC分类号： H01G4/0085 , H01B1/16
摘要： An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90° or less as measured in a nitrogen atmosphere.
摘要翻译：描述了即使在低氧浓度的气氛中即使在严格控制气氛的情况下也能形成致密电极膜的导电性糊料。包含Cu粉末，玻璃料和有机粘合剂树脂的导电糊料，其中玻璃料包含含Zn和Cu的硼硅酸盐玻璃，并且在熔融状态下，相对于Cu的接触角为90°或更小，如氮气氛围。

4. 发明授权

US5781402A Conducting thick film composition, thick film electrode, ceramic electronic component and laminated ceramic capacitor 失效
标题翻译：传导厚膜组合物，厚膜电极，陶瓷电子元件和层压陶瓷电容器
公开(公告)号：US5781402A
公开(公告)日：1998-07-14
申请号：US578105
申请日：1995-12-26
申请人： Masaki Fujiyama , Yukio Sanada , Shuji Mushimoto, deceased
发明人： Masaki Fujiyama , Yukio Sanada , Shuji Mushimoto, deceased
IPC分类号： B22F1/00 , C09D5/24 , C22C32/00 , H01B1/00 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/09 , H01G4/06 , B22F7/04 , H01G4/008
CPC分类号： H01G4/2325 , B22F1/0007 , C22C32/0089 , H05K1/092 , B22F2999/00 , Y10T428/12014 , Y10T428/1209
摘要： A conducting thick film composition, a thick film electrode made by sintering this composition, and a ceramic electronic component and a laminated ceramic capacitor in which this thick film electrode is used of which the electrical reliability are improved by the strength of the bond between the ceramic substrate and a thick film electrode being increased by the elimination of blistering and cracking of the electrode during sintering of the composition and the adherence of solder to the electrode being improved by the elimination of glass separation out onto the surface of the electrode during sintering. The conducting thick film composition comprises Cu powder, glass powder and an organic vehicle, the Cu powder comprises spherical powder and scaly powder and the glass powder comprises borosilicate zinc glass and borosilicate barium glass.
摘要翻译：导电厚膜组合物，通过烧结该组合物制成的厚膜电极以及陶瓷电子部件和层叠陶瓷电容器，其中使用该厚膜电极，通过陶瓷之间的结合强度提高电可靠性通过在烧结期间消除电极的起泡和破裂，并且通过在烧结期间消除在电极表面上的玻璃分离来改善焊料对电极的粘附，从而提高了衬底和厚膜电极。导电厚膜组合物包括Cu粉末，玻璃粉末和有机载体，Cu粉末包含球形粉末和鳞片状粉末，玻璃粉末包含硼硅酸锌玻璃和硼硅酸钡玻璃。

5. 发明授权

US08804302B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08804302B2
公开(公告)日：2014-08-12
申请号：US13187617
申请日：2011-07-21
申请人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka , Masaki Hirota
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka , Masaki Hirota
IPC分类号： H01C7/13
CPC分类号： H01C7/008 , H01C7/13 , H01F17/0013 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083
摘要： A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0≦t1≦(⅖)t0 is satisfied, where t0 is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.
摘要翻译：陶瓷电子部件包括陶瓷基体，第一和第二内部电极以及第一和第二外部电极。第一外部电极设置在纵向方向上的第一主表面的第一端部处。第二外部电极设置在第一主表面的纵向方向的第二端部处。第一外部电极和第二外部电极中的每一个的一部分在厚度方向上与第一和第二内部电极在厚度方向上彼此相对的区域相对。满足条件（1/10）t0＆nlE; t1＆nlE;（⅖）t0，其中t0是第一和第二外部电极中的每一个的厚度，t1是其中第一和第二外部电极中的每一个的部分的厚度嵌入第一主表面。

6. 发明授权

US07005192B2 Ceramic electronic component and method of producing the same 有权
公开(公告)号：US07005192B2
公开(公告)日：2006-02-28
申请号：US10107099
申请日：2002-03-26
申请人： Yukio Sanada , Yoshinori Saito
发明人： Yukio Sanada , Yoshinori Saito
IPC分类号： B32B31/00 , B32B9/04 , C25D5/34 , C25D5/54
CPC分类号： H01G4/248 , C23C18/1865 , C23C18/1882 , Y10T29/435 , Y10T29/49155 , Y10T428/31663
摘要： A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains a ceramic member, and terminal electrodes formed on both of end-faces of the ceramic member. Each terminal electrode comprises an external electrode, and a plating coat formed thereon. To produce the ceramic electronic component, the ceramic member having the external electrodes are dipped into a water-repelling agent, dried, and plated. The water-repelling agent contains a functional group which is readily adsorbed to the external electrodes and a hydrophobic functional group.

7. 发明授权

US08819932B2 Method of manufacturing a ceramic electronic component 有权
标题翻译：制造陶瓷电子部件的方法
公开(公告)号：US08819932B2
公开(公告)日：2014-09-02
申请号：US13184607
申请日：2011-07-18
申请人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
IPC分类号： H05K3/02
CPC分类号： H05K1/183 , H01C1/14 , H01C7/008 , H01C7/02 , H01F27/2804 , H01F2027/2809 , H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/228 , H01L41/083 , H05K1/186 , H05K3/321 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10439 , H05K2201/10636 , Y02P70/611 , Y10T29/49085 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
摘要翻译：陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。在每个陶瓷生片的表面上形成第一导电糊层。层叠陶瓷生片以形成原料陶瓷层叠体。在原料陶瓷层叠体的表面上形成第二导电糊层。形成有第二导电膏层的原料陶瓷层叠体被烧制。

8. 发明授权

US08564931B2 Ceramic electronic component and method for manufacturing the same 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US08564931B2
公开(公告)日：2013-10-22
申请号：US13115243
申请日：2011-05-25
申请人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Seiichi Matsumoto
发明人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Seiichi Matsumoto
IPC分类号： H01G4/00
CPC分类号： H05K1/182 , H01C7/008 , H01F27/28 , H01F27/2804 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083 , H01L41/1876
摘要： A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
摘要翻译：陶瓷电子部件包括陶瓷元件组件和外部电极。外部电极设置在陶瓷元件组件上。外部电极包括下面的电极层和第一个Cu镀膜。底层电极层设置在陶瓷元件组件上。第一Cu镀膜设置在下面的电极层上。底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

9. 发明授权

US06558524B2 Barrel plating method and apparatus 有权
标题翻译：桶式镀膜方法及装置
公开(公告)号：US06558524B2
公开(公告)日：2003-05-06
申请号：US09814004
申请日：2001-03-22
申请人： Yukio Sanada , Kenichi Hayashi
发明人： Yukio Sanada , Kenichi Hayashi
IPC分类号： C25D500
CPC分类号： C25D17/20
摘要： A plating barrel includes a rotatable barrel of which the exterior shape is approximately a hexagonal column, cathode-lead connections which penetrate through end surfaces of the barrel generally along a rotational axis of the barrel, cathodes placed inside the barrel and which are connected to the ends of the cathode-lead connections, and attachments which are attached to the cathode-lead connections or the barrel in a manner such that the central axes of the attachments are approximately the same as the rotational axis of the barrel, the vertices of the attachments point toward the center of the barrel, and peripheral portions of the bases of the attachments at the opposite ends relative to the vertices are close to the inside end surfaces of the barrel so that objects do not pass through the gaps.
摘要翻译：电镀桶包括可旋转的筒，其外部形状大致为六边形柱，阴极引线连接部，其通常沿着枪管的旋转轴线穿过枪管的端面，阴极设置在枪管内并连接到枪管阴极引线连接件的端部以及附接到阴极引线连接件或枪管的附件，使得附件的中心轴线大致与枪管的旋转轴线相同，附件的顶点指向筒的中心，并且相对于顶点的相对端处的附件的基部的周边部分靠近筒的内端表面，使得物体不通过间隙。

10. 发明授权

US08259433B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08259433B2
公开(公告)日：2012-09-04
申请号：US12617834
申请日：2009-11-13
申请人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Kosuke Onishi
发明人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Kosuke Onishi
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/232
摘要： In a ceramic electronic component having a thin structure, the occurrence of cracks due to stress applied when the ceramic component is being mounted or in a mounted state are prevented. Each of first and second external terminal electrodes has a substantially rectangular region on a principal surface of a ceramic element body, the principal surface being directed to the mounting surface side. An end of the first external terminal electrode, which is arranged in contact with a gap region, and an end of the second external terminal electrode, which is positioned in contact with the gap region, each preferably have a concave-convex shape on the principal surface.
摘要翻译：在具有薄结构的陶瓷电子部件中，防止了当安装陶瓷部件或处于安装状态时施加的应力引起的裂纹的发生。第一外部端子电极和第二外部端子电极中的每一个在陶瓷元件主体的主表面上具有基本上矩形的区域，主表面指向安装表面侧。与间隙区域接触的第一外部端子电极的端部和与间隙区域接触的第二外部端子电极的端部各自优选地在主体上具有凹凸形状表面。

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