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    • 2. 发明授权
    • Bulk acoustic wave resonator and manufacturing method thereof, filter using the same, semiconductor integrated circuit device using the same, and high frequency module using the same
    • 体声波谐振器及其制造方法,使用其的滤波器,使用其的半导体集成电路器件,以及使用其的高频模块
    • US07221242B2
    • 2007-05-22
    • US11067374
    • 2005-02-28
    • Kengo AsaiHisanori MatsumotoAtsushi IsobeMitsutaka Hikita
    • Kengo AsaiHisanori MatsumotoAtsushi IsobeMitsutaka Hikita
    • H03H9/00H01L41/00
    • H03H3/02H03H9/0542H03H9/0571H03H9/174H03H9/564H03H9/706
    • A bulk acoustic wave resonator in which the problem of the technology for forming the diaphragm structure is resolved, which is more compact and improved the frequency accuracy, and the manufacturing method thereof, a filter using the same, a semiconductor integrated circuit device using the same, and a high frequency module using the same are provided. The bulk acoustic wave resonator according to the present invention comprises a substrate having a first surface and a second surface opposite to the first surface, and a staked resonator including a first electrode film in contact with the first surface, a piezoelectric film overlaying the first electrode film and a second electrode film overlaying the piezoelectric film. The substrate is provided with an air gap including a first aperture opening at the first surface and a second aperture opening at the second surface at the position corresponding to the staked resonator, respectively and having air gap generally vertical shape to the first surface, and another air gap having a tapered shape in the vicinity of the first surface.
    • 解决了用于形成隔膜结构的技术的问题的体声波谐振器,其更紧凑并且提高了频率精度,其制造方法,使用该隔膜结构的滤波器,使用该隔膜结构的半导体集成电路器件 ,并且提供使用该模块的高频模块。 根据本发明的体声波谐振器包括具有与第一表面相对的第一表面和第二表面的基板,以及包括与第一表面接触的第一电极膜的支架谐振器,覆盖第一电极的压电膜 膜和覆盖压电膜的第二电极膜。 衬底设置有气隙,该空气间隙包括在第一表面处的第一孔径开口和位于对应于桩状共振器的位置处的第二表面处的第二孔口开口,并且具有大致垂直于第一表面的气隙,另一个 气隙在第一表面附近具有锥形形状。