专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09250619B2 Systems and methods of automatic boundary control for semiconductor processes 有权
标题翻译：半导体工艺自动边界控制系统和方法
公开(公告)号：US09250619B2
公开(公告)日：2016-02-02
申请号：US13311601
申请日：2011-12-06
申请人： Chih-Wei Hsu , Mei-Jen Wu , Yen-Di Tsen , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chih-Wei Hsu , Mei-Jen Wu , Yen-Di Tsen , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , G05B19/18 , H01L21/66
CPC分类号： G05B19/18 , G05B2219/45031 , H01L22/20
摘要： A system and method of automatically calculating boundaries for a semiconductor fabrication process. The method includes selecting a first parameter for monitoring during a semiconductor fabrication process. A first set of values for the first parameter are received and a group value of the first set is determined. Each value in the first set of values is normalized. A first weighting factor is selected based on a number of values in the first set. The embodiment also includes generating a first and a second boundary value as a function of the weighting factor, the first set normalized values and the group value of the first set and applying the first and second boundary values to control the semiconductor fabrication process.
摘要翻译：一种自动计算半导体制造工艺边界的系统和方法。该方法包括在半导体制造过程中选择用于监测的第一参数。接收第一参数的第一组值，并确定第一组的组值。第一组值中的每个值都被归一化。基于第一组中的值的数量来选择第一加权因子。该实施例还包括根据加权因子，第一集合归一化值和第一组的组值产生第一和第二边界值，并施加第一和第二边界值以控制半导体制造过程。

2. 发明申请

US20140033159A1 Method of Optimizing Design for Manufacturing (DFM) 有权
标题翻译：优化制造设计的方法（DFM）
公开(公告)号：US20140033159A1
公开(公告)日：2014-01-30
申请号：US13559081
申请日：2012-07-26
申请人： Keuing Hui , Yen-Wei Cheng , Yen-Di Tsen , Jong-I Mou , Chin-Hsiang Lin
发明人： Keuing Hui , Yen-Wei Cheng , Yen-Di Tsen , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , G06F2217/12 , Y02P90/265
摘要： The present disclosure describes a method of optimizing a design for manufacture (DFM) simulation. The method includes receiving an integrated circuit (IC) design data having a feature, receiving a process data having a parameter or a plurality of parameters, performing the DFM simulation, and optimizing the DFM simulation. The performing the DFM simulation includes generating a simulation output data using the IC design data and the process data. The optimizing the DFM simulation includes generating a performance index of the parameter or the plurality of parameters by the DFM simulation. The optimizing the DFM simulation includes adjusting the parameter or the plurality of parameters at outer loop, middle loop, and the inner loop. The optimizing the DFM simulation also includes locating a nadir of the performance index of the parameter or the plurality of parameters over a range of the parameter or the plurality of parameters.
摘要翻译：本公开描述了优化用于制造（DFM）仿真的设计的方法。该方法包括接收具有特征的集成电路（IC）设计数据，接收具有参数或多个参数的处理数据，执行DFM仿真和优化DFM仿真。执行DFM模拟包括使用IC设计数据和过程数据生成模拟输出数据。优化DFM模拟包括通过DFM仿真生成参数或多个参数的性能指标。优化DFM模拟包括调整外循环，中间循环和内循环的参数或多个参数。优化DFM模拟还包括在参数或多个参数的范围内定位参数或多个参数的性能指标的最低点。

3. 发明授权

US08793638B2 Method of optimizing design for manufacturing (DFM) 有权
标题翻译：优化制造设计（DFM）的方法
公开(公告)号：US08793638B2
公开(公告)日：2014-07-29
申请号：US13559081
申请日：2012-07-26
申请人： Keuing Hui , Yen-Wei Cheng , Yen-Di Tsen , Jong-I Mou , Chin-Hsiang Lin
发明人： Keuing Hui , Yen-Wei Cheng , Yen-Di Tsen , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , G06F2217/12 , Y02P90/265
摘要： The present disclosure describes a method of optimizing a design for manufacture (DFM) simulation. The method includes receiving an integrated circuit (IC) design data having a feature, receiving a process data having a parameter or a plurality of parameters, performing the DFM simulation, and optimizing the DFM simulation. The performing the DFM simulation includes generating a simulation output data using the IC design data and the process data. The optimizing the DFM simulation includes generating a performance index of the parameter or the plurality of parameters by the DFM simulation. The optimizing the DFM simulation includes adjusting the parameter or the plurality of parameters at outer loop, middle loop, and the inner loop. The optimizing the DFM simulation also includes locating a nadir of the performance index of the parameter or the plurality of parameters over a range of the parameter or the plurality of parameters.
摘要翻译：本公开描述了优化用于制造（DFM）仿真的设计的方法。该方法包括接收具有特征的集成电路（IC）设计数据，接收具有参数或多个参数的处理数据，执行DFM仿真和优化DFM仿真。执行DFM模拟包括使用IC设计数据和过程数据生成模拟输出数据。优化DFM模拟包括通过DFM仿真生成参数或多个参数的性能指标。优化DFM模拟包括调整外循环，中间循环和内循环的参数或多个参数。优化DFM模拟还包括在参数或多个参数的范围内定位参数或多个参数的性能指标的最低点。

4. 发明授权

US10047439B2 Method and system for tool condition monitoring based on a simulated inline measurement 有权
公开(公告)号：US10047439B2
公开(公告)日：2018-08-14
申请号：US13314850
申请日：2011-12-08
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , C23C16/52 , H01L21/66
摘要： A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.

5. 发明授权

US09349660B2 Integrated circuit manufacturing tool condition monitoring system and method 有权
标题翻译：集成电路制造工具状态监测系统及方法
公开(公告)号：US09349660B2
公开(公告)日：2016-05-24
申请号：US13308644
申请日：2011-12-01
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , H01L21/66
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A system and method for monitoring a process tool of an integrated circuit manufacturing system are disclosed. An exemplary method includes defining zones of an integrated circuit manufacturing process tool; grouping parameters of the integrated circuit manufacturing process tool based on the defined zones; and evaluating a condition of the integrated circuit manufacturing process tool based on the grouped parameters.
摘要翻译：公开了一种用于监控集成电路制造系统的处理工具的系统和方法。示例性方法包括限定集成电路制造工艺工具的区域; 基于定义的区域对集成电路制造工艺工具进行分组参数; 并基于分组的参数来评估集成电路制造处理工具的状况。

6. 发明申请

US20130306621A1 REAL-TIME CALIBRATION FOR WAFER PROCESSING CHAMBER LAMP MODULES 有权
标题翻译：用于加工室内灯模块的实时校准
公开(公告)号：US20130306621A1
公开(公告)日：2013-11-21
申请号：US13471583
申请日：2012-05-15
申请人： Chih-Tien Chang , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chih-Tien Chang , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： H05B1/02
CPC分类号： H01L22/26 , H01L21/324 , H01L21/67115 , H01L21/67248 , H05B1/0233
摘要： An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer processing chamber. The apparatus further includes radiant heating elements disposed in different zones and operable to heat different portions of a wafer located within the wafer processing chamber. The apparatus further includes sensors disposed outside the wafer processing chamber and operable to monitor energy from the radiant heating elements disposed in the different zones. The apparatus further includes a computer configured to utilize the sensors to characterize the radiant heating elements disposed in the different zones and to provide a calibration for the radiant heating elements disposed in the different zones such that a substantially uniform temperature profile is maintained across a surface of the wafer.
摘要翻译：公开了一种装置，系统和方法。示例性装置包括晶片处理室。该设备还包括设置在不同区域中的辐射加热元件，其可操作以加热位于晶片处理室内的晶片的不同部分。该装置还包括设置在晶片处理室外部的传感器，其可操作以监测来自设置在不同区域中的辐射加热元件的能量。该装置还包括计算机，其被配置为利用传感器来表征设置在不同区域中的辐射加热元件，并且为放置在不同区域中的辐射加热元件提供校准，使得基本上均匀的温度分布保持在晶圆。

7. 发明申请

US20130144419A1 INTEGRATED CIRCUIT MANUFACTURING TOOL CONDITION MONITORING SYSTEM AND METHOD 有权
标题翻译：集成电路制造工具条件监控系统及方法
公开(公告)号：US20130144419A1
公开(公告)日：2013-06-06
申请号：US13308644
申请日：2011-12-01
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A system and method for monitoring a process tool of an integrated circuit manufacturing system are disclosed. An exemplary method includes defining zones of an integrated circuit manufacturing process tool; grouping parameters of the integrated circuit manufacturing process tool based on the defined zones; and evaluating a condition of the integrated circuit manufacturing process tool based on the grouped parameters.
摘要翻译：公开了一种用于监控集成电路制造系统的处理工具的系统和方法。示例性方法包括限定集成电路制造工艺工具的区域; 基于定义的区域对集成电路制造工艺工具进行分组参数; 并基于分组的参数来评估集成电路制造处理工具的状况。

8. 发明授权

US09727049B2 Qualitative fault detection and classification system for tool condition monitoring and associated methods 有权
公开(公告)号：US09727049B2
公开(公告)日：2017-08-08
申请号：US13603079
申请日：2012-09-04
申请人： Chia-Tong Ho , Po-Feng Tsai , Jung-Chang Chen , Tze-Liang Lee , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chia-Tong Ho , Po-Feng Tsai , Jung-Chang Chen , Tze-Liang Lee , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , G05B19/4065
CPC分类号： G05B19/4065 , G05B2219/37252 , G05B2219/45031
摘要： The present disclosure provides various methods for tool condition monitoring, including systems for implementing such monitoring. An exemplary method includes receiving data associated with a process performed on wafers by an integrated circuit manufacturing process tool; and monitoring a condition of the integrated circuit manufacturing process tool using the data. The monitoring includes evaluating the data based on an abnormality identification criterion, an abnormality filtering criterion, and an abnormality threshold to determine whether the data meets an alarm threshold. The method may further include issuing an alarm when the data meets the alarm threshold.

9. 发明申请

US20140067324A1 QUALITATIVE FAULT DETECTION AND CLASSIFICATION SYSTEM FOR TOOL CONDITION MONITORING AND ASSOCIATED METHODS 有权
标题翻译：用于工具条件监测和相关方法的定性故障检测和分类系统
公开(公告)号：US20140067324A1
公开(公告)日：2014-03-06
申请号：US13603079
申请日：2012-09-04
申请人： Chia-Tong Ho , Po-Feng Tsai , Jung-Chang Chen , Tze-Liang Lee , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chia-Tong Ho , Po-Feng Tsai , Jung-Chang Chen , Tze-Liang Lee , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F15/00
CPC分类号： G05B19/4065 , G05B2219/37252 , G05B2219/45031
摘要： The present disclosure provides various methods for tool condition monitoring, including systems for implementing such monitoring. An exemplary method includes receiving data associated with a process performed on wafers by an integrated circuit manufacturing process tool; and monitoring a condition of the integrated circuit manufacturing process tool using the data. The monitoring includes evaluating the data based on an abnormality identification criterion, an abnormality filtering criterion, and an abnormality threshold to determine whether the data meets an alarm threshold. The method may further include issuing an alarm when the data meets the alarm threshold.
摘要翻译：本公开提供了用于工具状态监测的各种方法，包括用于实现这种监视的系统。一种示例性方法包括：通过集成电路制造工艺工具接收与在晶片上执行的处理相关联的数据; 以及使用该数据来监视集成电路制造工艺工具的状态。监视包括基于异常识别标准，异常过滤标准和异常阈值来评估数据，以确定数据是否满足报警阈值。该方法还可以包括当数据满足报警阈值时发出报警。

10. 发明申请

US20130150997A1 METHOD AND SYSTEM FOR TOOL CONDITION MONITORING 审中-公开
标题翻译：工具条件监测方法与系统
公开(公告)号：US20130150997A1
公开(公告)日：2013-06-13
申请号：US13314850
申请日：2011-12-08
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00
CPC分类号： C23C16/52 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.
摘要翻译：公开了一种用于从刀具状态监测的在线测量数据中去除控制动作效果的方法和系统。一种示例性方法包括确定有助于在线测量的控制动作效果，其中在线测量指示由处理工具处理的晶片的晶片特性; 并且在没有控制动作效应贡献的情况下评估在线测量来确定过程工具的状况。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式