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1. 发明申请

US20060055432A1 Semiconductor module 失效
公开(公告)号：US20060055432A1
公开(公告)日：2006-03-16
申请号：US11214730
申请日：2005-08-31
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H03D13/00
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

2. 发明授权

US07633153B2 Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US07633153B2
公开(公告)日：2009-12-15
申请号：US11778516
申请日：2007-07-16
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H01L23/10
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要翻译：半导体模块包括安装板。多个电源开关器件芯片通过倒装芯片接合安装在安装板上。芯片具有上表面和下表面，并且被配置为面向安装板的上表面。通过倒装芯片接合将驱动IC芯片安装在安装板上。驱动IC芯片用于驱动形成在多个功率开关器件芯片中的晶体管的栅极。多个散热构件分别位于多个功率开关器件芯片的下表面上。提供树脂构件以将单个封装中的多个功率开关器件芯片和驱动IC芯片密封。

3. 发明授权

US07514783B2 Semiconductor module 失效
公开(公告)号：US07514783B2
公开(公告)日：2009-04-07
申请号：US11214730
申请日：2005-08-31
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H01L23/34
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

4. 发明申请

US20070257708A1 SEMICONDUCTOR MODULE 失效
标题翻译：半导体模块
公开(公告)号：US20070257708A1
公开(公告)日：2007-11-08
申请号：US11778516
申请日：2007-07-16
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H03D13/00
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要翻译：半导体模块包括安装板。多个电源开关器件芯片通过倒装芯片接合安装在安装板上。芯片具有上表面和下表面，并且被配置为面向安装板的上表面。通过倒装芯片接合将驱动IC芯片安装在安装板上。驱动IC芯片用于驱动形成在多个功率开关器件芯片中的晶体管的栅极。多个散热构件分别位于多个功率开关器件芯片的下表面上。提供树脂构件以将单个封装中的多个功率开关器件芯片和驱动IC芯片密封。

5. 发明申请

US20070257376A1 SEMICONDUCTOR MODULE 审中-公开
公开(公告)号：US20070257376A1
公开(公告)日：2007-11-08
申请号：US11778493
申请日：2007-07-16
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H01L23/48
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

6. 发明授权

US06518791B2 Gate driver for driving a switching element, and a power converter in which the gate driver and an output element are integrated in one-chip 失效
标题翻译：用于驱动开关元件的栅极驱动器和其中栅极驱动器和输出元件集成在单芯片中的功率转换器
公开(公告)号：US06518791B2
公开(公告)日：2003-02-11
申请号：US09811448
申请日：2001-03-20
申请人： Tsutomu Kojima , Hiroshi Takei , Morio Takahashi , Akira Yamashita
发明人： Tsutomu Kojima , Hiroshi Takei , Morio Takahashi , Akira Yamashita
IPC分类号： H03K300
CPC分类号： H03K5/1534 , H03K17/0828 , H03K2017/0806
摘要： A gate driver includes an edge detection circuit, an ON pulse generation circuit, first and second OFF pulse generation circuit and a status hold circuit. The first OFF pulse generation circuit generates a first OFF pulse in response to a leading or trailing edge of a control input signal, which is detected by the edge detection circuit. The status hold circuit drives an output element in response to the ON pulse outputted from the ON pulse generation circuit and holds driving status of the output element until a first OFF pulse is outputted from the first OFF pulse generation circuit. The second OFF pulse generation circuit generates a second OFF pulse in response to a protect operation signal and supplies this pulse to the status hold circuit, thereby to stop driving of the output element.
摘要翻译：栅极驱动器包括边沿检测电路，ON脉冲产生电路，第一和第二OFF脉冲产生电路和状态保持电路。第一OFF脉冲产生电路响应由边缘检测电路检测到的控制输入信号的前沿或后沿产生第一OFF脉冲。状态保持电路响应于从ON脉冲发生电路输出的ON脉冲驱动输出元件，并保持输出元件的驱动状态，直到从第一OFF脉冲发生电路输出第一OFF脉冲为止。第二OFF脉冲产生电路响应于保护操作信号产生第二OFF脉冲，并将该脉冲提供给状态保持电路，从而停止驱动输出元件。

7. 发明授权

US07285854B2 Wire bonding method and semiconductor device 有权
标题翻译：引线接合方法和半导体器件
公开(公告)号：US07285854B2
公开(公告)日：2007-10-23
申请号：US11063866
申请日：2005-02-24
申请人： Katsumi Ishikawa , Nobuya Makino , Hiroshi Takei
发明人： Katsumi Ishikawa , Nobuya Makino , Hiroshi Takei
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： B23K20/007 , H01L23/49575 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05556 , H01L2224/05599 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48599 , H01L2224/48992 , H01L2224/48997 , H01L2224/4911 , H01L2224/49113 , H01L2224/49427 , H01L2224/78301 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01052 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2224/85186 , H01L2924/00 , H01L2224/48227 , H01L2224/48455 , H01L2924/00015 , H01L2224/4554 , H01L2924/00012
摘要： A wire bonding method for bonding a plurality of conducting wires to connect first conductors and second conductors has the following steps. 1) Bonding a first conducting ball on a first first conductor. 2) Bonding a first conducting wire on the first conducting ball, the first conducting wire being connected to a first second conductor. 3) Bonding a second conducting ball on a second first conductor. 4) Bonding a second conducting wire on the second conducting ball, the second conducting wire being connected to a second second conductor. Here, the second first conductor or the second second conductor is the first conducting wire bonded on the first conducting ball.
摘要翻译：用于接合多根导线以连接第一导体和第二导体的引线接合方法具有以下步骤。 1）将第一导电球接合在第一第一导体上。 2）将第一导线接合在第一导电球上，第一导线连接到第一导体。 3）将第二导电球接合在第二个第一导体上。 4）将第二导线接合在第二导电球上，第二导线连接到第二导体。这里，第二第一导体或第二第二导体是接合在第一导电球上的第一导线。

8. 发明授权

US06676870B1 Process for the preparation of fiber-filled thermoplastic resin composition 有权
标题翻译：制备纤维填充热塑性树脂组合物的方法
公开(公告)号：US06676870B1
公开(公告)日：2004-01-13
申请号：US09529351
申请日：2000-04-13
申请人： Takahiro Hattori , Hiroshi Takei
发明人： Takahiro Hattori , Hiroshi Takei
IPC分类号： B29B1116
CPC分类号： B29B15/125 , B29C47/0014 , B29C47/027
摘要： A production process for a long fiber-filled thermoplastic resin composition using an apparatus having an extruder with at least two raw material feeding ports and a resin impregnating bath at the tip of the extruder, comprising the steps of feeding a resin mixture to a first feeding port provided at an upstream position of the extruder, feeding alkaline earth metals to a second feeding port provided at a downstream position of the extruder, melt-kneading to a mixture, allowing the obtained molten resin mixture to flow into the resin impregnating bath, passing a continuous fiber bundle through the molten resin mixture in the resin impregnating bath to impregnate the continuous fiber bundle with the resin mixture.
摘要翻译：一种长纤维填充热塑性树脂组合物的生产方法，该方法使用具有至少两个原料供给口的挤出机和挤出机前端处的树脂浸渍浴的装置，包括以下步骤：将树脂混合物进料到第一进料设置在挤出机的上游位置，将碱土金属供给到设置在挤出机下游位置的第二进料口，熔融捏合到混合物中，使得到的熔融树脂混合物流入树脂浸渍浴中，通过通过树脂浸渍浴中的熔融树脂混合物连续纤维束，以用树脂混合物浸渍连续纤维束。

9. 发明授权

US06306957B1 Thermal conductive silicone rubber compositions and making method 有权
标题翻译：导热硅橡胶组合物及其制备方法
公开(公告)号：US06306957B1
公开(公告)日：2001-10-23
申请号：US09521776
申请日：2000-03-09
申请人： Akio Nakano , Hiroshi Takei , Takeshi Hashimoto , Yuuki Sakurai
发明人： Akio Nakano , Hiroshi Takei , Takeshi Hashimoto , Yuuki Sakurai
IPC分类号： C08K310
CPC分类号： C08L83/04 , C08G77/045 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/24 , C08G77/70 , C08L83/00 , C08L2666/54
摘要： An organopolysiloxane, a hydrolyzable group-bearing methylpolysiloxane, a thermal conductive filler, and a curing agent are blended to form a silicone rubber composition which is minimized in viscosity or plasticity increase and remains effectively moldable and workable even when loaded with a large amount of the thermal conductive filler. It cures into a silicone rubber part having a high thermal conductivity.
摘要翻译：将有机聚硅氧烷，可水解基团的甲基聚硅氧烷，导热填料和固化剂混合以形成硅橡胶组合物，其在粘度或塑性增加方面最小化，并且即使在加载大量的导热填料。它固化成具有高导热性的硅橡胶部件。

10. 发明授权

US5532056A Fixing belt 失效
标题翻译：固定带
公开(公告)号：US5532056A
公开(公告)日：1996-07-02
申请号：US174546
申请日：1993-12-28
申请人： Makoto Satoh , Noboru Shimamoto , Hiroshi Takei , Takeshi Hashimoto
发明人： Makoto Satoh , Noboru Shimamoto , Hiroshi Takei , Takeshi Hashimoto
IPC分类号： C08G65/00 , C08L71/02 , G03G15/20 , B32B15/08
CPC分类号： G03G15/2057 , C08G65/007 , C08L71/02 , Y10T428/139 , Y10T428/1393 , Y10T428/1397 , Y10T428/259 , Y10T428/26 , Y10T428/266 , Y10T428/3154 , Y10T428/31663 , Y10T428/31667 , Y10T428/31721 , Y10T428/31786
摘要： A fixing belt is prepared by forming a layer of fluorosilicone rubber or fluorocarbon-siloxane rubber on the outer surface of an endless belt body. The fixing belt shows good toner release and minimal swell with silicone oil and is thus helpful in producing electrophotographic quality images.
摘要翻译：通过在环形带体的外表面上形成氟硅橡胶或氟碳硅氧烷橡胶层来制备定影带。定影带显示出良好的调色剂释放和用硅油的最小溶胀，因此有助于产生电子照相质量图像。

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