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1. 发明授权

US07514783B2 Semiconductor module 失效
公开(公告)号：US07514783B2
公开(公告)日：2009-04-07
申请号：US11214730
申请日：2005-08-31
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H01L23/34
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

2. 发明申请

US20070282336A1 Bipolar high-frequency treatment tool for endoscope 审中-公开
标题翻译：双极高频内窥镜治疗工具
公开(公告)号：US20070282336A1
公开(公告)日：2007-12-06
申请号：US11442418
申请日：2006-05-30
申请人： Tomohiro Kawano
发明人： Tomohiro Kawano
IPC分类号： A61B18/18
CPC分类号： A61B18/1445 , A61B2017/00477 , A61B2017/2945 , A61B2018/126 , A61B2018/1422 , A61B2018/1432 , A61B2018/146 , A61B2018/1495
摘要： A high-frequency treatment tool for an endoscope includes a connector configured to be connected to an inserting portion of an endoscope and further configured to be inserted into a body cavity through an endoscope, and first and second electrodes mounted to a distal end of the connector and movable between an open position and a closed position.. The first electrode is connected, at a proximal end, with a conductive wire configured to be provided with high frequency voltage of a first polarity, the second electrode is connected, at a proximal end, with a conductive wire configured to be provided with high frequency voltage of a second polarity, the first and second electrodes each have a tip portion extending at an angle from the respective first and second electrodes, and the opposed surfaces of the first and second electrodes are positioned closer to each other in the closed position than in the open position.
摘要翻译：一种用于内窥镜的高频处理工具，包括：连接器，被配置为连接到内窥镜的插入部分，并且还被构造成通过内窥镜插入到体腔中，以及安装到连接器的远端的第一和第二电极并且可在打开位置和关闭位置之间移动。所述第一电极在近端处与配置成具有第一极性的高频电压的导线连接，所述第二电极在近端连接通过配置成具有第二极性的高频电压的导线，所述第一和第二电极各自具有从所述第一和第二电极以一定角度延伸的尖端部分，并且所述第一和第二电极的相对表面在关闭位置中比在打开位置更靠近彼此。

3. 发明申请

US20070257708A1 SEMICONDUCTOR MODULE 失效
标题翻译：半导体模块
公开(公告)号：US20070257708A1
公开(公告)日：2007-11-08
申请号：US11778516
申请日：2007-07-16
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H03D13/00
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要翻译：半导体模块包括安装板。多个电源开关器件芯片通过倒装芯片接合安装在安装板上。芯片具有上表面和下表面，并且被配置为面向安装板的上表面。通过倒装芯片接合将驱动IC芯片安装在安装板上。驱动IC芯片用于驱动形成在多个功率开关器件芯片中的晶体管的栅极。多个散热构件分别位于多个功率开关器件芯片的下表面上。提供树脂构件以将单个封装中的多个功率开关器件芯片和驱动IC芯片密封。

4. 发明申请

US20070257376A1 SEMICONDUCTOR MODULE 审中-公开
公开(公告)号：US20070257376A1
公开(公告)日：2007-11-08
申请号：US11778493
申请日：2007-07-16
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H01L23/48
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

5. 发明授权

US4612974A Heat storage device 失效
标题翻译：蓄热装置
公开(公告)号：US4612974A
公开(公告)日：1986-09-23
申请号：US704413
申请日：1985-02-22
申请人： Michio Yanadori , Tomohiro Kawano , Seigo Miyamoto , Yasuaki Nara , Masahiro Oguri
发明人： Michio Yanadori , Tomohiro Kawano , Seigo Miyamoto , Yasuaki Nara , Masahiro Oguri
IPC分类号： F24H7/00 , F28D20/00 , F28D20/02 , F28D17/00
CPC分类号： F24H7/00 , F28D20/00 , F28D20/02 , Y02E60/142 , Y02E60/145
摘要： A heat storage device is disclosed in which grooves for supports supporting heat storage vessels, each vessel storing therein a heat storage material, are defined on the lower surface of each of the vessels so that the supports do not project from the bottom surface of each vessel.
摘要翻译：公开了一种蓄热装置，其中，在每个容器的下表面上限定有用于支撑蓄热容器的支撑物的槽，每个存储有蓄热材料的容器，以使得支撑体不从每个容器的底表面突出。

6. 发明授权

US08062310B2 Clipping instrument for an endoscopic surgical device 有权
标题翻译：内窥镜手术器械的剪切仪器
公开(公告)号：US08062310B2
公开(公告)日：2011-11-22
申请号：US11934997
申请日：2007-11-05
申请人： Hiroaki Shibata , Tomohiro Kawano
发明人： Hiroaki Shibata , Tomohiro Kawano
IPC分类号： A61B17/10
CPC分类号： A61B17/1285 , A61B2017/2905 , A61B2017/2929
摘要： A clipping instrument for an endoscope is provided. The clipping instrument includes a flexible sheath and at least one clip assembly with a pair of openable and closable clipping arms. The clip assembly is arranged in vicinity to a distal end portion of the flexible sheath with the clipping arms closed. The clipping arms are configured to be protruded forward to open outside the flexible sheath and to be closed to clip onto a treatment object outside the flexible sheath. The clipping instrument further includes an operating wire, which is configured to be forwarded and retracted to operate the pair of arms to be opened and closed. The clip assembly includes a bendable portion, which corresponds to a position of a shaft to support the clipping arms. The clip assembly can be arbitrarily bended at the bendable portion.
摘要翻译：提供了一种用于内窥镜的夹具。夹具包括柔性护套和至少一个具有一对可开启和闭合的夹持臂的夹子组件。夹子组件布置在柔性护套的远端部分附近，夹持臂关闭。夹臂被构造成向前突出以在柔性护套的外部打开并且被封闭以夹在柔性护套外部的处理对象上。夹持仪器还包括操作线，其被配置为被前进和后退以操作要打开和关闭的一对臂。夹子组件包括可弯曲部分，其可对应于轴的位置以支撑夹持臂。夹子组件可以在可弯曲部分任意弯曲。

7. 发明申请

US20100191257A1 ACTUATOR AND DETACHABLE CONNECTOR OF FLEXIBLE CLIP APPLIER 有权
标题翻译：柔性夹具的致动器和可拆卸连接器
公开(公告)号：US20100191257A1
公开(公告)日：2010-07-29
申请号：US12359821
申请日：2009-01-26
申请人： Jean-Luc BOULNOIS , Masayasu SATO , Tomohiro KAWANO
发明人： Jean-Luc BOULNOIS , Masayasu SATO , Tomohiro KAWANO
IPC分类号： A61B17/10
CPC分类号： A61B17/1285 , A61B17/128 , A61B2017/2905
摘要： A clip applier for deploying a surgical clip includes an actuator having a flexible wire and a collet chuck coupled to a piston. Further, actuation of the piston in a forward direction towards a distal end of the clip applier advances the flexible wire in the forward direction.
摘要翻译：用于部署手术夹的夹具包括具有柔性线的致动器和联接到活塞的夹头卡盘。此外，活塞沿向前方向朝向夹具施加器的远端的致动使柔性线沿向前方向前进。

8. 发明申请

US20100106167A1 FLEXIBLE CLIP APPLIER 有权
标题翻译：柔性夹具
公开(公告)号：US20100106167A1
公开(公告)日：2010-04-29
申请号：US12256698
申请日：2008-10-23
申请人： Jean-Luc Boulnois , Tomohiro KAWANO , Masayasu SATO
发明人： Jean-Luc Boulnois , Tomohiro KAWANO , Masayasu SATO
IPC分类号： A61B17/10 , A61B19/00
CPC分类号： A61B17/1285 , A61B17/00234 , A61B17/1227 , A61B2017/00292 , A61B2017/2905
摘要： A clip applier includes a shaft having a proximal end and a distal end. Further, the distal end of the shaft includes a flexible tool having at least two rails connected to each other by at least one jointed connection, and the at least two rails configured to rotate about the jointed connection. Additionally, a pair of jaws may be provided at a distal end of the flexible tool. Further, an actuator may be provided at the proximal end of the shaft to advance the surgical clip within the flexible tool.
摘要翻译：夹具包括具有近端和远端的轴。此外，轴的远端包括具有通过至少一个接合连接彼此连接的至少两个轨道的柔性工具，并且所述至少两个轨道构造成围绕接合连接旋转。另外，可以在柔性工具的远端设置一对钳口。此外，致动器可以设置在轴的近端处，以将手术夹子推进到柔性工具内。

9. 发明申请

US20080306492A1 CLIPPING INSTRUMENT FOR AN ENDOSCOPIC SURGICAL DEVICE 审中-公开
标题翻译：用于内窥镜手术装置的夹具
公开(公告)号：US20080306492A1
公开(公告)日：2008-12-11
申请号：US12123694
申请日：2008-05-20
申请人： Hiroaki SHIBATA , Tomohiro KAWANO
发明人： Hiroaki SHIBATA , Tomohiro KAWANO
IPC分类号： A61B17/10
CPC分类号： A61B17/1285 , A61B2017/0034
摘要： A clipping instrument for an endoscope is provided. The clipping instrument includes a flexible sheath, an operation wire, which can be forwarded and retracted in an axial direction of the flexible sheath, at least one detachable clip assembly, including a pair of openable and closable clipping arms which can be projected forward to open outside the flexible sheath and to be closed to clip onto a treatment object outside the flexible sheath according to forwarding and retracting movements of the operation wire, and frictional members, which can generate frictional resistance between each other inside the flexible sheath. The frictional resistance is generated while the clipping arms of the clip assembly are forwarded by the forwarding movement of the operation wire to project out of the flexible sheath to be fully opened.
摘要翻译：提供了一种用于内窥镜的夹具。夹具包括柔性护套，可沿柔性护套的轴向方向前进和后退的操作线，至少一个可拆卸的夹子组件，其包括一对可开启和关闭的夹持臂，其可向前突出以打开根据操作线的前进和后退运动以及可在柔性护套内彼此之间产生摩擦阻力的摩擦构件，在柔性护套之外并被封闭以夹在柔性护套外部的处理物体上。当夹子组件的夹持臂通过操作线的前进运动而被推出弹性护套以完全打开时产生摩擦阻力。

10. 发明申请

US20070282331A1 Bipolar high-frequency incision tool for an endoscope 审中-公开
标题翻译：用于内窥镜的双极高频切割工具
公开(公告)号：US20070282331A1
公开(公告)日：2007-12-06
申请号：US11442424
申请日：2006-05-30
申请人： Tomohiro Kawano
发明人： Tomohiro Kawano
IPC分类号： A61B18/14
CPC分类号： A61B18/1445 , A61B1/018 , A61B2018/1422
摘要： A bipolar high-frequency incision tool for an endoscope having a flexible insertion portion configured to be inserted into a body cavity. First and second elongated electrodes mounted to a distal end of the insertion portion so as to be movable between an open position and a closed position. The first and second electrodes being connected with conductive wires that provide a high frequency voltage, and having corresponding first and second surfaces. The first and second surfaces are spaced apart from each other when the first and second electrodes are in an open position, and the first and second electrodes remain spaced from one another when the first and second electrodes are moved to the closed position. In addition, the first and second surfaces each have inwardly tapered side surfaces configured to form respective blade edges.
摘要翻译：一种用于内窥镜的双极性高频切割工具，其具有被构造成插入到体腔中的柔性插入部。第一和第二细长电极安装到插入部分的远端，以便能够在打开位置和关闭位置之间移动。第一和第二电极与提供高频电压的导线连接，并且具有对应的第一和第二表面。当第一和第二电极处于打开位置时，第一和第二表面彼此间隔开，并且当第一和第二电极移动到关闭位置时，第一和第二电极保持彼此间隔开。此外，第一和第二表面各自具有构造成形成相应叶片边缘的向内锥形侧表面。

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