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1. 发明授权

US07514783B2 Semiconductor module 失效
公开(公告)号：US07514783B2
公开(公告)日：2009-04-07
申请号：US11214730
申请日：2005-08-31
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H01L23/34
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

2. 发明授权

US07492133B2 Semiconductor device configured to complementarily control on/off of a high-side switching element 失效
标题翻译：半导体装置，被配置为互补地控制高侧开关元件的开/关
公开(公告)号：US07492133B2
公开(公告)日：2009-02-17
申请号：US11863934
申请日：2007-09-28
申请人： Noriaki Yoshikawa
发明人： Noriaki Yoshikawa
IPC分类号： G05F1/10 , G05F1/652
CPC分类号： H02M1/38 , H02M3/1588 , Y02B70/1466
摘要： According to the present invention, a semiconductor device is provided wherein a stepdown-type DC-DC converter includes a first off detection circuit, a second off detection circuit, a capacitor, a capacitor, a diode, inverters, an inductor, a first level shift circuit, a second level shift circuit, a third level shift circuit, a 2-input NAND circuit, a 2-input NAND circuit, a high-side N-channel power MOS transistor and a low-side N-channel power MOS transistor. The first off detection circuit and the second off detection circuit reduce fall times of the gates of the N-channel power MOS transistors, thereby reducing dead time.
摘要翻译：根据本发明，提供了一种半导体器件，其中降压型DC-DC转换器包括第一关断检测电路，第二关断检测电路，电容器，电容器，二极管，反相器，电感器，第一电平移位电路，第二电平移位电路，第三电平移位电路，2输入NAND电路，2输入NAND电路，高侧N沟道功率MOS晶体管和低侧N沟道功率MOS晶体管。第一关断检测电路和第二关断检测电路减少N沟道功率MOS晶体管的栅极的下降时间，从而减少死区时间。

3. 发明申请

US20070262762A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20070262762A1
公开(公告)日：2007-11-15
申请号：US11828395
申请日：2007-07-26
申请人： Noriaki YOSHIKAWA
发明人： Noriaki YOSHIKAWA
IPC分类号： G05F1/40
CPC分类号： H02M1/38 , H03K17/04206 , H03K17/165 , H03K2217/0036
摘要： A semiconductor device having conversion units which change the reference potential of an input signal to a first or second reference potential and outputs the input signal to a first drive unit or second drive unit , change the reference potential of a first control signal output from the first drive unit to the second reference potential and outputs the first control signal to the second drive unit, and changes the reference potential of a second control signal output from the second drive unit to the first reference potential and outputs the second control signal to the first drive unit, wherein the conversion units increase currents flowing through the conversion units on the basis of a time when the input signal changes.
摘要翻译：一种具有转换单元的半导体器件，其将输入信号的参考电位改变为第一或第二参考电位，并将输入信号输出到第一驱动单元或第二驱动单元，改变从第一驱动单元或第二驱动单元输出的第一控制信号的参考电位驱动单元到第二参考电位，并将第一控制信号输出到第二驱动单元，并且将从第二驱动单元输出的第二控制信号的参考电位改变为第一参考电位，并将第二控制信号输出到第一驱动单元，其中转换单元基于输入信号改变的时间增加流过转换单元的电流。

4. 发明申请

US20070257708A1 SEMICONDUCTOR MODULE 失效
标题翻译：半导体模块
公开(公告)号：US20070257708A1
公开(公告)日：2007-11-08
申请号：US11778516
申请日：2007-07-16
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H03D13/00
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要翻译：半导体模块包括安装板。多个电源开关器件芯片通过倒装芯片接合安装在安装板上。芯片具有上表面和下表面，并且被配置为面向安装板的上表面。通过倒装芯片接合将驱动IC芯片安装在安装板上。驱动IC芯片用于驱动形成在多个功率开关器件芯片中的晶体管的栅极。多个散热构件分别位于多个功率开关器件芯片的下表面上。提供树脂构件以将单个封装中的多个功率开关器件芯片和驱动IC芯片密封。

5. 发明申请

US20070257376A1 SEMICONDUCTOR MODULE 审中-公开
公开(公告)号：US20070257376A1
公开(公告)日：2007-11-08
申请号：US11778493
申请日：2007-07-16
申请人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
发明人： Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
IPC分类号： H01L23/48
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/36 , H01L23/367 , H01L23/4822 , H01L23/49805 , H01L23/49844 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L25/0655 , H01L25/165 , H01L29/4175 , H01L29/7802 , H01L29/7806 , H01L29/7809 , H01L29/7813 , H01L29/7835 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

6. 发明申请

US20070063678A1 Semiconductor device 失效
公开(公告)号：US20070063678A1
公开(公告)日：2007-03-22
申请号：US11513120
申请日：2006-08-31
申请人： Noriaki Yoshikawa
发明人： Noriaki Yoshikawa
IPC分类号： G05F1/00
CPC分类号： H02M1/38 , H03K17/04206 , H03K17/165 , H03K2217/0036
摘要： According to this invention, there is provided a semiconductor device having conversion units which change the reference potential of an input signal to a first or second reference potential and outputs the input signal to a first drive unit or second drive unit, change the reference potential of a first control signal output from the first drive unit to the second reference potential and outputs the first control signal to the second drive unit, and changes the reference potential of a second control signal output from the second drive unit to the first reference potential and outputs the second control signal to the first drive unit, wherein the conversion units increase currents flowing through the conversion units on the basis of a time when the input signal changes.

7. 发明授权

US06267123B1 Pod and method of cleaning it 失效
公开(公告)号：US06267123B1
公开(公告)日：2001-07-31
申请号：US09265539
申请日：1999-03-09
申请人： Noriaki Yoshikawa , Tadashi Yotsumoto , Terumi Muguruma , Yoshitaka Hasegawa , Yuichi Kuroda
发明人： Noriaki Yoshikawa , Tadashi Yotsumoto , Terumi Muguruma , Yoshitaka Hasegawa , Yuichi Kuroda
IPC分类号： B08B302
CPC分类号： H01L21/67028 , B08B3/04 , B08B9/087 , B08B9/093 , H01L21/67051 , H01L21/67772 , Y10S134/902
摘要： A pod for storing and carrying substrates consists of a pod body and a cover. An inlet and an outlet are formed on one of the pod body and cover. The cover is tightly fitted to the pod body to close the inside of the pod body. A washing liquid is introduced into the pod through the inlet and is discharged from the pod through the outlet, thereby easily washing the inside of the pod with the pod itself serving as a washing tank. A washing cover has an inlet, an outlet, and a heater. The washing cover is attached to the pod body when washing the inside of the pod body. Further provided is a cleaning apparatus having pipes and a pump that are connected to the washing cover. The cleaning apparatus may have a table serving as the washing cover. The table is connected to pipes and a pump.

8. 发明授权

US6123120A Clean storage equipment for substrates and method of storing substrates 失效
标题翻译：基材清洁储存设备和储存基材的方法
公开(公告)号：US6123120A
公开(公告)日：2000-09-26
申请号：US203491
申请日：1998-12-02
申请人： Tadashi Yotsumoto , Terumi Muguruma , Noriaki Yoshikawa , Yuichi Kuroda
发明人： Tadashi Yotsumoto , Terumi Muguruma , Noriaki Yoshikawa , Yuichi Kuroda
IPC分类号： B65B31/04 , H01L21/02 , H01L21/673 , B65B1/04
CPC分类号： H01L21/67769 , H01L21/67389
摘要： Storage equipment simply and effectively maintains the cleanness of substrates stored therein. The substrates in the storage equipment are set in a pod. The storage equipment has removable covers, a unit for fitting the covers to pods, respectively, a unit for holding the pods with the covers, a gas supply unit for individually supplying gas into the pods through the covers, and an exhaust unit for individually discharging an atmosphere from the pods through the covers. Each pod is closed with the cover in the storage equipment, and the gas supply unit and exhaust unit periodically replace an atmosphere in each pod with inert gas or evacuate each pod, to control the storage conditions of each pod in the storage equipment.
摘要翻译：存储设备简单有效地保持其中存储的基板的清洁度。存储设备中的基板被设置在容器中。存储设备具有可移除的盖，用于将盖安装到舱的单元，用于将盖保持在盖上的单元，用于通过盖单独地将气体供应到舱中的气体供应单元，以及用于单独排出的排气单元从荚果通过盖子的气氛。每个荚用存储设备中的盖子封闭，气体供应单元和排气单元周期性地用惰性气体代替每个舱中的气氛或排空每个舱，以控制存储设备中每个舱的储存条件。

9. 发明授权

US4726230A Ultrasound imaging apparatus 失效
标题翻译：超声成像装置
公开(公告)号：US4726230A
公开(公告)日：1988-02-23
申请号：US886427
申请日：1986-07-17
申请人： Noriaki Yoshikawa , Atsushi Nakai
发明人： Noriaki Yoshikawa , Atsushi Nakai
IPC分类号： A61B8/00 , G01S7/52 , G01S15/89 , G10K11/34 , G01N29/06
CPC分类号： G10K11/345 , G01S15/8918 , G01S7/52046
摘要： An ultrasound imaging apparatus transmits or receives an ultrasound beam by switching connections between ultrasound probes and a transmitting and receiving system. Channels of the transmitting and receiving system are respectively connected to first and second connectors through first and second N switching elements. Each of the first and second connectors has N connecting terminals. The terminals of the first and second connectors are respectively connected to 2N terminals of a third connector. The switching elements and the first to third connectors constitute a switching circuit. The switching elements in the switching circuit are selectively turned on/off according to a desired ultrasound transducer connected to a corresponding one of the first to third connectors, thereby causing the ultrasound transducer to transmit or receive the ultrasound beam.
摘要翻译：超声波成像设备通过切换超声波探头与发射和接收系统之间的连接来发射或接收超声波束。发送和接收系统的通道分别通过第一和第二N个开关元件连接到第一和第二连接器。第一和第二连接器中的每一个具有N个连接端子。第一和第二连接器的端子分别连接到第三连接器的2N个端子。开关元件和第一至第三连接器构成开关电路。切换电路中的开关元件根据连接到第一至第三连接器中对应的一个的期望的超声波换能器选择性地接通/断开，从而使超声波换能器发射或接收超声波束。

10. 发明授权

US4144412A Method of assigning a radio channel to a calling mobile body of mobile communication system and radio channel assigning system therefor 失效
标题翻译：向移动通信系统的主叫移动体分配无线信道的方法及其无线信道分配系统
公开(公告)号：US4144412A
公开(公告)日：1979-03-13
申请号：US760124
申请日：1977-01-17
申请人： Sadao Ito , Noriaki Yoshikawa , Mitsuru Komura
发明人： Sadao Ito , Noriaki Yoshikawa , Mitsuru Komura
IPC分类号： H04B7/26 , H04W72/08 , H04Q7/04
CPC分类号： H04W72/085 , H04B7/2621
摘要： The service area of the system is divided into a plurality of overlapping radio zones and a mobile-system base station is installed in each zone. The mobile-system base stations are assigned with a common control channel and each station is assigned with a plurality of speech channels which are commonly controlled by the control channel. Where a mobile body originates a transmission, the intensities of signals received by respective stations which have resulted from a signal transmitted by the mobile body are compared so as to designate an idle speech channel of a station which has received a signal having the maximum intensity among mobile-system base stations including the idle speech channel.
摘要翻译：系统的服务区域被分成多个重叠的无线电区域，并且在每个区域中安装移动系统基站。移动系统基站被分配有公共控制信道，并且每个站被分配有由控制信道共同控制的多个语音信道。在移动体发起传输的情况下，将由移动体发送的信号产生的各个站所接收的信号的强度进行比较，以指定接收到具有最大强度的信号的站的空闲语音信道移动系统基站包括空闲语音信道。

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