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    • 3. 发明授权
    • Trimbit circuit for flash memory
    • 闪存集成电路的Trimbit电路
    • US5933370A
    • 1999-08-03
    • US5074
    • 1998-01-09
    • Peter HolzmannJames Brennan, Jr.Anthony DunneHieu Van Tran
    • Peter HolzmannJames Brennan, Jr.Anthony DunneHieu Van Tran
    • G11C16/06G11C29/00G11C29/04G11C16/04
    • G11C29/789
    • A trimbit circuit for flash memory integrated circuits is described. The trimbit circuit is used to store the addresses of bad rows and/or columns in flash memory arrays. Furthermore the trimbit circuit is used to store the trimbits for trimable circuits in the integrated circuit, i.e. voltage references, precision oscillator, etc. The invention includes a row of flash memory trimcells and a trimcell differential amplifier circuit. The trimcell differential amplifier circuit can serially shift in trimbits into a latch and serially shift out trimbits without having to program the flash memory trimcells. The final settings of the trimbits can be programmed by means of a high voltage buffer. A non-overlapping clock generator and additional logic is also included to control the circuit.
    • 描述了闪存集成电路的三段电路。 trimbit电路用于存储闪存阵列中不良行和/或列的地址。 此外,trimbit电路用于存储集成电路中的可修整电路的三角形,即电压基准,精密振荡器等。本发明包括一排闪存微调单元和微调单元差分放大器电路。 微调单元差分放大器电路可以将三位组串行移位到锁存器中,并且串行地移出三位符,而不必对闪存微调单元进行编程。 可以通过高电压缓冲区对三角形的最终设置进行编程。 还包括不重叠的时钟发生器和附加逻辑来控制电路。
    • 10. 发明授权
    • Electrically reprogrammable EPROM cell with merged transistor and
optiumum area
    • 具有合并晶体管和光电面积的电可重编程EPROM单元
    • US5293328A
    • 1994-03-08
    • US821165
    • 1992-01-15
    • Alaaeldin A. M. AminJames Brennan, Jr.
    • Alaaeldin A. M. AminJames Brennan, Jr.
    • H01L21/8247G11C16/04H01L29/788H01L29/792G11C11/40H01L29/68
    • H01L29/7886G11C16/0425
    • A novel nonvolatile memory cell structure is provided using a non-self aligned CMOS process with two independent N+ implants using a two or a three polysilicon layer technology that allows in-circuit electrical erase and reprogramming together with reduction in cell size requirement. The novel memory cell is implemented with a merged transistor structure having an access transistor and a programmable transistor. The memory cell is constructed by having the control gate, formed of a first polysilicon layer, covering a portion of the channel length between drain and source to form the access portion of the merged transistors, and a floating gate formed of a second polysilicon layer overlapping a second portion of the channel length to form the programmable transistor portion of the merged transistor. Such merged transistor structure is equivalent to two transistors in series, a programmable transistor in series with an access transistor. A memory cell structure described in accordance with this invention allows a reduction of the portion of the floating gate covering the programmable transistor portion of the channel length. This results in a reduction in the floating gate to substrate capacitance (C.sub.FB) thereby improving the programming coupling ratio and reducing the overall cell size.
    • 使用具有两个或三个多晶硅层技术的具有两个独立N +注入的非自对准CMOS工艺提供了一种新颖的非易失性存储单元结构,其允许在电池电擦除和重新编程以及减小单元尺寸要求。 新颖的存储器单元由具有存取晶体管和可编程晶体管的合并晶体管结构来实现。 存储单元通过具有由第一多晶硅层形成的控制栅极构成,该第一多晶硅层覆盖漏极和源极之间的沟道长度的一部分以形成合并晶体管的存取部分,以及由第二多晶硅层重叠形成的浮置栅极 沟道长度的第二部分,以形成合并晶体管的可编程晶体管部分。 这种合并的晶体管结构相当于串联的两个晶体管,一个与存取晶体管串联的可编程晶体管。 根据本发明描述的存储单元结构允许减少覆盖通道长度的可编程晶体管部分的浮动栅极的部分。 这导致浮栅对基极电容(CFB)的降低,从而提高编程耦合比并降低整体单元尺寸。