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    • 4. 发明授权
    • Semiconductor laser device
    • 半导体激光器件
    • US08270446B2
    • 2012-09-18
    • US12718009
    • 2010-03-05
    • Takashi ShiotaTakeshi Kitatani
    • Takashi ShiotaTakeshi Kitatani
    • H01S5/00
    • H01S5/3434B82Y20/00H01S5/0265H01S5/12H01S5/187H01S5/2209H01S5/2226H01S5/2227H01S5/2275
    • High performance and high reliability of a semiconductor laser device having a buried-hetero structure are achieved. The semiconductor laser device having a buried-hetero structure is manufactured by burying both sides of a mesa structure by a Ru-doped InGaP wide-gap layer and subsequently by a Ru-doped InGaP graded layer whose composition is graded from InGaP to InP, and then, by a Ru-doped InP layer. By providing the Ru-doped InGaP graded layer between the Ru-doped InGaP wide-gap layer and the Ru-doped InP layer, the Ru-doped InGaP wide-gap layer and the Ru-doped InP layer not lattice-matching with each other can be formed as a buried layer with excellent crystallinity.
    • 实现了具有掩埋异质结构的半导体激光器件的高性能和高可靠性。 具有掩埋异质结构的半导体激光器件通过用Ru掺杂的InGaP宽间隙层掩埋台面结构的两面并随后通过组成从InGaP分级为InP的Ru掺杂的InGaP梯度层而制造,以及 然后,通过Ru掺杂的InP层。 通过在Ru掺杂的InGaP宽间隙层和Ru掺杂的InP层之间提供Ru掺杂的InGaP渐变层,Ru掺杂的InGaP宽间隙层和Ru掺杂的InP层彼此不格子匹配 可以形成具有优异结晶度的埋层。
    • 10. 发明授权
    • Light receiving element and a method of fabricating the same
    • 光接收元件及其制造方法
    • US5747864A
    • 1998-05-05
    • US688741
    • 1996-07-31
    • Takeshi KitataniYoshiaki YazawaJunko MinemuraAkira SatoTerunori Warabisako
    • Takeshi KitataniYoshiaki YazawaJunko MinemuraAkira SatoTerunori Warabisako
    • H01L31/04H01L27/142H01L31/0304H01L31/0352H01L31/05H01L31/10H01L31/18H01L29/04H01L31/075
    • H01L31/184H01L31/03042H01L31/03529H01L31/047H01L31/05H01L31/1804Y02E10/544Y02E10/547Y02P70/521
    • A light receiving element having excellent characteristics, including high sensitivity and high response speed, can be achieved by a light element comprising unit structures each having two pn junction semiconductor layers, and a lightly doped semiconductor layer having low impurity density, lower than those of the p-type regions and the n-type regions of the two pn junction semiconductor layers, and which is sandwiched between the two pn junction semiconductor layers. The p-type regions of the pn junction semiconductor layers are disposed opposite to each other on opposite sides of the lightly doped semiconductor layer, respectively, and the n-type regions of the pn junction semiconductor layers are disposed opposite to each other on the opposite sides of the lightly doped semiconductor layer, respectively. In a method of fabricating such a light receiving element, using controlled shutters or an ion beam apparatus, the layers are formed of optimum semiconductors, in an optimum thickness and in optimum impurity densities. In this structure, photogenerated carriers move mainly through the lightly doped semiconductor layer. Therefore, the lifetime of the carriers is increased, and the drift mobility of the carriers is enhanced, so that the light receiving element is able to function with a high sensitivity at a high response speed.
    • 具有高灵敏度和高响应速度的具有优异特性的光接收元件可以通过包括单元结构的光元件实现,该元件具有两个pn结半导体层,以及低杂质浓度的轻掺杂半导体层, p型区域和两个pn结半导体层的n型区域,并且夹在两个pn结半导体层之间。 pn结半导体层的p型区域分别在轻掺杂半导体层的相对侧彼此相对设置,并且pn结半导体层的n型区域在相对的对置设置为彼此相对 侧掺杂半导体层。 在制造这种光接收元件的方法中,使用受控的快门或离子束装置,这些层由最佳半导体形成,具有最佳厚度和最佳杂质浓度。 在这种结构中,光生载流子主要通过轻掺杂的半导体层移动。 因此,载流子的寿命增加,并且载流子的漂移迁移率增强,使得光接收元件能够以高响应速度以高灵敏度起作用。