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    • 4. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08658999B2
    • 2014-02-25
    • US13728552
    • 2012-12-27
    • Yoshifumi NishiTakao MarukameTakayuki IshikawaMasato Koyama
    • Yoshifumi NishiTakao MarukameTakayuki IshikawaMasato Koyama
    • H01L29/02
    • H01L45/14H01L27/2472H01L45/08H01L45/1233H01L45/1253H01L45/16
    • According to an embodiment, a semiconductor device includes first and second memristors. The first memristor includes a first electrode made of a first material, a second electrode made of a second material, and a first resistive switching film arranged between the first and second electrodes. The first resistive switching film is connected to both the first and second electrodes. The second memristor includes a third electrode made of a third material, a fourth electrode made of the second material, and a second resistive switching film arranged between the third and fourth electrodes. The second resistive switching film is connected to both the third and fourth electrodes. The work function of the first material is smaller than that of the second material. The work function of the third material is larger than that of the second material.
    • 根据实施例,半导体器件包括第一和第二忆阻器。 第一忆阻器包括由第一材料制成的第一电极,由第二材料制成的第二电极和布置在第一和第二电极之间的第一电阻切换膜。 第一电阻开关膜连接到第一和第二电极。 第二忆阻器包括由第三材料制成的第三电极,由第二材料制成的第四电极和布置在第三和第四电极之间的第二电阻切换膜。 第二电阻开关膜连接到第三和第四电极。 第一材料的功函数小于第二材料的功函数。 第三种材料的功函数大于第二种材料的功函数。
    • 5. 发明授权
    • Apparatus and system for improved thermal radiation for a mobile computing device and case
    • 用于移动计算设备和壳体的用于改进热辐射的装置和系统
    • US08355248B2
    • 2013-01-15
    • US12970859
    • 2010-12-16
    • Yoshifumi Nishi
    • Yoshifumi Nishi
    • H05K7/20
    • G06F1/203
    • Embodiments of an apparatus and system are described for a thermally radiating mobile computing device and case. An apparatus may comprise, for example, a thermally radiating case for a mobile computing device having a first portion arranged to receive the mobile computing device, a thermally conductive coupling arranged to removably couple the case to one or more internal heat generating components of the mobile computing device, and a second portion thermally coupled to the first portion and the thermally conductive coupling, the second portion comprising one or more thermally conductive materials arranged to radiate thermal energy away from the one or more heat generating components. Other embodiments are described and claimed.
    • 对于热辐射移动计算设备和情况描述了设备和系统的实施例。 设备可以包括例如用于移动计算设备的散热壳体,其具有布置成接收移动计算设备的第一部分,布置成将壳体可移除地耦合到移动设备的一个或多个内部发热部件的导热联接器 计算装置,以及热耦合到第一部分和导热联接件的第二部分,第二部分包括一个或多个导热材料,其布置成将热能辐射离开一个或多个发热部件。 描述和要求保护其他实施例。
    • 9. 发明申请
    • Method, apparatus and system for flow distribution through a heat exchanger
    • 通过热交换器流量分配的方法,装置和系统
    • US20070227699A1
    • 2007-10-04
    • US11394822
    • 2006-03-31
    • Yoshifumi Nishi
    • Yoshifumi Nishi
    • F28F1/24F28D15/02
    • F28D15/0266F28F1/24
    • A method, apparatus and system are described for flow distribution through a heat exchanger. The system may include a chassis and an apparatus. The apparatus may include a heat exchanger, and a cold plate. In some embodiments, a pump may provide for the flow of the fluid between the heat exchanger and the cold plate. In some embodiments, the heat exchanger may include a tube to transport a first fluid, a plurality of fins coupled to the tube to facilitate transfer of thermal energy from the first fluid to the plurality of fins, and a gate coupled to the plurality of fins to direct flow of a second fluid through passages between the fins, where the gate includes a deformable laminate of a plurality of layers having different coefficients of thermal expansion, the plurality of layers being bonded to one another. Other embodiments may be described.
    • 描述了通过热交换器的流量分配的方法,装置和系统。 该系统可以包括底盘和装置。 该装置可以包括热交换器和冷板。 在一些实施例中,泵可以提供热交换器和冷板之间的流体流。 在一些实施例中,热交换器可以包括用于输送第一流体的管,耦合到管的多个翅片以便于将热能从第一流体传递到多个翅片,以及耦合到多个翅片的门 引导第二流体通过翅片之间的通道的流动,其中门包括具有不同热膨胀系数的多个层的可变形层压体,多个层彼此结合。 可以描述其他实施例。