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1. 发明授权

US09535086B2 Interface of a microfabricated scanning force sensor for combined force and position sensing 有权
标题翻译：用于组合力和位置感测的微加工扫描力传感器的接口
公开(公告)号：US09535086B2
公开(公告)日：2017-01-03
申请号：US14742105
申请日：2015-06-17
申请人： FEMTOTOOLS AG
发明人： Felix Beyeler , Simon Muntwyler
IPC分类号： G01Q20/00 , B81C99/00 , G01Q20/04 , G01Q60/36 , G01N3/42 , G01L1/14 , G01L5/00 , G01Q10/04
CPC分类号： G01Q20/00 , B81C99/005 , G01L1/148 , G01L5/0038 , G01N3/42 , G01N2203/0286 , G01Q10/045 , G01Q20/04 , G01Q60/366
摘要： A micro fabricated sensor for micro-mechanical and nano-mechanical testing and nano-indentation. The sensor includes a force sensing capacitive comb drive for the sensing of a force applied to a sample, a position sensing capacitive comb drive for the sensing of the position of a sample and a micro fabricated actuator to apply a load to the sample. All the sensor components mentioned above are monolithically integrated on the same silicon MEMS chip.
摘要翻译：一种用于微机械和纳米机械测试和纳米压痕的微型制造传感器。传感器包括用于感测施加到样本的力的力感测电容梳驱动器，用于感测样品位置的感测位置感应电容梳驱动器和微制造致动器以向样品施加负载。上述所有传感器组件都是单片集成在同一个硅MEMS芯片上。

2. 发明申请

US20150145543A1 MEMS DEVICE POSITIONING APPARATUS, TEST SYSTEM, AND TEST METHOD 有权
标题翻译： MEMS器件定位装置，测试系统和测试方法
公开(公告)号：US20150145543A1
公开(公告)日：2015-05-28
申请号：US14090068
申请日：2013-11-26
申请人： FREESCALE SEMICONDUCTOR, INC.
发明人： Thomas J. Birk
IPC分类号： G01N25/00 , G01R31/00
CPC分类号： G01R31/003 , B81C99/005
摘要： A positioning apparatus includes a support structure, a positioning structure, and a fixture for retaining MEMS devices. A shaft spans between the support structure and the positioning structure, and is configured to rotate about a first axis relative to the support structure in order to rotate the positioning structure and the fixture about the first axis. The positioning structure includes a pair of beams spaced apart by a third beam. Another shaft spans between the pair of beams and is configured to rotate about a second axis relative to the positioning structure in order to rotate the fixture about the second axis. Methodology entails installing the positioning apparatus into a chamber, orienting the fixture into various positions, and obtaining output signals from the MEMS devices to determine functionality of the MEMS devices.
摘要翻译：定位装置包括支撑结构，定位结构和用于保持MEMS装置的固定装置。轴跨过支撑结构和定位结构，并且构造成相对于支撑结构围绕第一轴线旋转，以便围绕第一轴线旋转定位结构和固定装置。定位结构包括由第三梁间隔开的一对梁。另一个轴跨在一对梁之间，并且构造成相对于定位结构围绕第二轴线旋转，以便围绕第二轴线旋转固定件。方法学需要将定位装置安装到室中，将夹具定向到各种位置，并且从MEMS装置获得输出信号以确定MEMS装置的功能。

3. 发明申请

US20150123129A1 WAFER LEVEL PACKAGING TECHNIQUES 有权
标题翻译： WAFER LEVEL包装技术
公开(公告)号：US20150123129A1
公开(公告)日：2015-05-07
申请号：US14072141
申请日：2013-11-05
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Yi-Chuan Teng , Jung-Huei Peng , Shang-Ying Tsai , Li-Min Hung , Yao-Te Huang , Chin-Yi Cho
IPC分类号： H01L21/66 , H01L23/00
CPC分类号： H01L24/06 , B81B2207/012 , B81C99/0045 , B81C99/005 , H01L22/32 , H01L23/10 , H01L24/32 , H01L24/94 , H01L2224/0605 , H01L2224/32145 , H01L2224/83194 , H01L2924/01322 , H01L2924/16235 , H01L2924/00
摘要： In a wafer level chip scale packaging technique for MEMS devices, a deep trench is etched on a scribe line area between two CMOS devices of a CMOS substrate at first. After bonding of the CMOS substrate with a MEMS substrate, the deep trench is opened by thin-down process so that CMOS substrate is singulated while MEMS substrate is not (partial singulation). Electrical test pad on MEMS substrate is exposed and protection material can be filled through the deep trench around bonding layers. After filling the protection material, the wafer is diced to form packaged individual chips with protection from environment outside bonding layer.
摘要翻译：在用于MEMS器件的晶片级芯片级封装技术中，首先在CMOS衬底的两个CMOS器件之间的刻划线区域上蚀刻深沟槽。在将CMOS衬底与MEMS衬底结合之后，通过薄层化工艺来打开深沟槽，使得在衬底不是（部分单片化）的情况下将CMOS衬底分离。 MEMS基板上的电测试板被暴露，保护材料可以通过粘结层周围的深沟槽填充。在填充保护材料之后，将晶片切割成形成封装的独立芯片，保护结合层外部的环境。

4. 发明申请

US20140266246A1 MCU-BASED COMPENSATION AND CALIBRATION FOR MEMS DEVICES 有权
标题翻译：基于MCU的MEMS器件的补偿和校准
公开(公告)号：US20140266246A1
公开(公告)日：2014-09-18
申请号：US13795704
申请日：2013-03-12
申请人： Bruno Debeurre , Tehmoor M. Dar , Raimondo P. Sessego
发明人： Bruno Debeurre , Tehmoor M. Dar , Raimondo P. Sessego
IPC分类号： G01R35/00 , B81B7/02
CPC分类号： G01R35/005 , B81C99/005
摘要： A sensor system includes a microelectromechanical systems (MEMS) sensor, a processor, measurement circuitry, stimulus circuitry and memory. The MEMS sensor is configured to provide an output responsive to physical displacement within the MEMS sensor to the measurement circuitry. The stimulus circuitry is configured to provide a stimulus signal to the MEMS sensor to cause a physical displacement within the MEMS sensor. The measurement circuitry is configured to process the output from the MEMS sensor and provide it to the processor. The processor is configured to generate stimulus signals and provide them to the stimulus circuitry for provision to the MEMS sensor. The processor is configured to monitor the output from the measurement circuitry corresponding to the physical displacement occurring in the MEMS sensor, calculate MEMS sensor characteristics based on the output, and update calibration values based on the output. Methods for monitoring and calibrating MEMS sensors are also provided.
摘要翻译：传感器系统包括微机电系统（MEMS）传感器，处理器，测量电路，刺激电路和存储器。 MEMS传感器被配置为提供响应于MEMS传感器内的物理位移到测量电路的输出。激励电路被配置为向MEMS传感器提供刺激信号以引起MEMS传感器内的物理位移。测量电路被配置为处理来自MEMS传感器的输出并将其提供给处理器。处理器被配置为产生刺激信号并将其提供给刺激电路以供应到MEMS传感器。处理器被配置为监视与MEMS传感器中发生的物理位移相对应的测量电路的输出，基于输出计算MEMS传感器特性，并基于输出更新校准值。还提供了用于监测和校准MEMS传感器的方法。

5. 发明授权

US08789425B2 Micro/nano-mechanical test system employing tensile test holder with push-to-pull transformer 有权
标题翻译：微/纳机械测试系统采用拉拔式测试架，带有推挽式变压器
公开(公告)号：US08789425B2
公开(公告)日：2014-07-29
申请号：US13888959
申请日：2013-05-07
申请人： Hysitron Inc.
发明人： Yunje Oh , Edward Cyrankowski , Zhiwei Shan , Syed Amanula Syed Asif
IPC分类号： G01L1/00
CPC分类号： G01L1/005 , B81C99/005 , G01N3/08 , G01N2203/0286 , G01N2203/0647
摘要： A micromachined or microelectromechanical system (MEMS) based push-to-pull mechanical transformer for tensile testing of micro-to-nanometer scale material samples including a first structure and a second structure. The second structure is coupled to the first structure by at least one flexible element that enables the second structure to be moveable relative to the first structure, wherein the second structure is disposed relative to the first structure so as to form a pulling gap between the first and second structures such that when an external pushing force is applied to and pushes the second structure in a tensile extension direction a width of the pulling gap increases so as to apply a tensile force to a test sample mounted across the pulling gap between a first sample mounting area on the first structure and a second sample mounting area on the second structure.
摘要翻译：一种用于对包括第一结构和第二结构的微米至纳米尺度材料样品的拉伸测试的基于微机械或微机电系统（MEMS）的推挽式机械变压器。第二结构通过至少一个可使第二结构相对于第一结构运动的柔性元件耦合到第一结构，其中第二结构相对于第一结构设置，以便在第一结构之间形成牵引间隙以及第二结构，使得当在拉伸延伸方向上施加外推力并推动所述第二结构时，所述牵引间隙的宽度增加，以便对安装在所述牵引间隙上的第一样品第一结构上的安装区域和第二结构上的第二样品安装区域。

6. 发明申请

US20130247688A1 METHOD AND DEVICE FOR MEASURING A MICROELECTROMECHANICAL SEMICONDUCTOR COMPONENT 有权
标题翻译：用于测量微电子半导体元件的方法和装置
公开(公告)号：US20130247688A1
公开(公告)日：2013-09-26
申请号：US13990349
申请日：2011-10-26
申请人： Peter Binkhoff
发明人： Peter Binkhoff
IPC分类号： B81C99/00
CPC分类号： G01L9/0098 , B81C99/003 , B81C99/005 , G01L27/002 , G01R31/275 , G01R31/2887 , G01R31/2891
摘要： In the method for measuring a micromechanical semiconductor component which comprises a reversibly deformable measuring element sensitive to mechanical stresses, which is provided with electronic circuit elements and terminal pads for tapping measurement signals, the measuring element (18) of the semiconductor component (16), for the purpose of determining the distance/force and/or distance/pressure characteristic curve thereof, is increasingly deformed by mechanical action of a plunger (32) which can in particular be advanced step by step. After a or after each step-by-step advancing movement of the plunger (32) by a predetermined distance quantity, the current measurement signals are tapped via the terminal pads (24). The semiconductor component (16) is qualified on the basis of the obtained measurement signals representing the distance/force and/or distance/pressure characteristic curve.
摘要翻译：在包括对机械应力敏感的可逆变形测量元件的微机电半导体部件的测量方法中，其具有用于分接测量信号的电子电路元件和端子焊盘，半导体部件（16）的测量元件（18）为了确定距离/力和/或其距离/压力特性曲线的目的，通过柱塞（32）的机械作用越来越大地变形，这可以特别地逐步提前。在柱塞（32）的逐步前进运动预定距离之后或之后，经由端子焊盘（24）敲击电流测量信号。基于获得的表示距离/力和/或距离/压力特性曲线的测量信号，对半导体部件（16）进行限定。

7. 发明授权

US08434370B2 Micro/nano-mechanical test system employing tensile test holder with push-to-pull transformer 有权
标题翻译：微/纳机械测试系统采用拉拔式测试架，带有推挽式变压器
公开(公告)号：US08434370B2
公开(公告)日：2013-05-07
申请号：US12575368
申请日：2009-10-07
申请人： Yunje Oh , Edward Cyrankowski , Zhiwei Shan , Syed Amanula Syed Asif
发明人： Yunje Oh , Edward Cyrankowski , Zhiwei Shan , Syed Amanula Syed Asif
IPC分类号： G01L1/00
CPC分类号： G01L1/005 , B81C99/005 , G01N3/08 , G01N2203/0286 , G01N2203/0647
摘要： A micromachined or microelectromechanical system (MEMS) based push-to-pull mechanical transformer for tensile testing of micro-to-nanometer scale material samples including a first structure and a second structure. The second structure is coupled to the first structure by at least one flexible element that enables the second structure to be moveable relative to the first structure, wherein the second structure is disposed relative to the first structure so as to form a pulling gap between the first and second structures such that when an external pushing force is applied to and pushes the second structure in a tensile extension direction a width of the pulling gap increases so as to apply a tensile force to a test sample mounted across the pulling gap between a first sample mounting area on the first structure and a second sample mounting area on the second structure.
摘要翻译：一种用于对包括第一结构和第二结构的微米至纳米尺度材料样品的拉伸测试的基于微机械或微机电系统（MEMS）的推挽式机械变压器。第二结构通过至少一个可使第二结构相对于第一结构运动的柔性元件耦合到第一结构，其中第二结构相对于第一结构设置，以在第一结构之间形成牵引间隙以及第二结构，使得当在拉伸延伸方向上施加外推力并推动所述第二结构时，所述牵引间隙的宽度增加，以便对安装在所述牵引间隙上的第一样品第一结构上的安装区域和第二结构上的第二样品安装区域。

8. 发明申请

US20110317157A1 APPARATUS AND METHOD FOR IN SITU TESTING OF MICROSCALE AND NANOSCALE SAMPLES 失效
标题翻译：用于微观和纳米样品样品测试的装置和方法
公开(公告)号：US20110317157A1
公开(公告)日：2011-12-29
申请号：US12823743
申请日：2010-06-25
申请人： Wonmo Kang , M. Taher A. Saif
发明人： Wonmo Kang , M. Taher A. Saif
IPC分类号： G01N21/01
CPC分类号： G01N3/02 , B81C99/005 , G01N2203/0016
摘要： According to example embodiments of the invention, a microscale testing stage comprises a frame having first and second opposing ends and first and second side beams, at least one deformable force sensor beam, a first longitudinal beam having a free end, a second longitudinal beam having a facing free end, a support structure, and a pair of slots disposed at each of the free ends. In certain embodiments, a separately fabricated microscale or nanoscale specimen comprises a central gauge length portion of a material to be tested, and first and second hinges providing a self-aligning mechanism for uniaxial loading. In other embodiments, a layer of a conductive material defines first and second conductive paths and an open circuit that can be closed by the specimen across the gap. In other embodiments, the stage is formed of a high melting temperature material.
摘要翻译：根据本发明的示例性实施例，微尺度测试台包括具有第一和第二相对端以及第一和第二侧梁的框架，至少一个可变形力传感器梁，具有自由端的第一纵向梁，具有面向自由端，支撑结构以及设置在每个自由端的一对槽。在某些实施例中，单独制造的微米级或纳米尺度样本包括待测试材料的中心标尺长度部分，以及提供用于单轴加载的自对准机构的第一和第二铰链。在其他实施例中，导电材料层限定了第一和第二导电路径以及开放电路，该开路可被样品跨过间隙封闭。在其它实施方案中，该阶段由高熔点材料形成。

9. 发明申请

US20100067780A1 DEFECT DETECTING APPARATUS, DEFECT DETECTING METHOD, INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM THEREFOR 有权
标题翻译：缺陷检测装置，缺陷检测方法，信息处理装置，信息处理方法及其程序
公开(公告)号：US20100067780A1
公开(公告)日：2010-03-18
申请号：US12516445
申请日：2007-11-30
申请人： Hiroshi Kawaragi
发明人： Hiroshi Kawaragi
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , B81C99/005 , G06T7/001 , G06T2207/30148
摘要： A defect detecting apparatus captures images of a protein chip formed on each die of a wafer at a plurality of different focal positions, with respect to every division region obtained by dividing each die in plurality; stores inspection target images for every division region at every focal position together with an ID for identifying each division region; creates a model image for every division region at every focal position by calculating an average luminance value of pixels of each inspection target image having the corresponding ID; extracts a difference between the model image and each inspection target image as a difference image; extracts a Blob having an area larger than a preset value from each difference image as a defect; and classifies the kind of the defect based on a feature point of the extracted Blob.
摘要翻译：缺陷检测装置相对于通过将每个管芯分割成多个而获得的每个分割区域捕获在多个不同焦点位置处形成在晶片的每个管芯上的蛋白质芯片的图像; 将每个焦点位置处的每个划分区域的检查对象图像与用于识别每个划分区域的ID一起存储; 通过计算具有对应ID的每个检查对象图像的像素的平均亮度值，在每个焦点位置为每个划分区域创建模型图像; 提取模型图像与每个检查对象图像之间的差作为差分图像; 从每个差异图像提取具有大于预设值的面积的Blob作为缺陷; 并根据提取的Blob的特征点对缺陷的种类进行分类。

10. 发明申请

US20090095095A1 MICROSTRUCTURE INSPECTING APPARATUS, MICROSTRUCTURE INSPECTING METHOD AND SUBSTRATE HOLDING APPARATUS 审中-公开
标题翻译：微结构检查装置，微结构检查方法和基板保持装置
公开(公告)号：US20090095095A1
公开(公告)日：2009-04-16
申请号：US12298359
申请日：2007-10-31
申请人： Masato Hayashi , Hisashi Fujiwara , Kazuki Amemiya
发明人： Masato Hayashi , Hisashi Fujiwara , Kazuki Amemiya
IPC分类号： G01M19/00
CPC分类号： H01L21/68735 , B81C99/005 , G01R31/2887
摘要： An inspecting apparatus of a microstructure having a movable section 16a with its both sides supported includes a chuck top 9 for holding a wafer 8 in which the microstructure is formed so as to make a main surface of the wafer 8 into a convexly or concavely curved shape having a nearly uniform curvature radius. The apparatus includes a shape changing unit for changing the curvature radius of the shape of the main surface of the wafer 8. The shape changing unit is a temperature controlling unit for changing a shape of a top surface of a chuck top 9, on which the substrate is mounted, according to a temperature. A transfer tray whose top surface, on which the wafer 8 is mounted, formed into a convexly or concavely curved shape may be interposed between the wafer 8 and the chuck top 9 whose top surface is flat.
摘要翻译：微结构的检查装置具有其两侧被支撑的可移动部分16a，包括用于保持其中形成有微结构的晶片8的卡盘顶部9，以使晶片8的主表面成凸形或凹形弯曲形状具有近似均匀的曲率半径。该装置包括用于改变晶片8的主表面的形状的曲率半径的形状改变单元。形状改变单元是用于改变卡盘顶部9的顶表面的形状的温度控制单元，根据温度安装基板。安装了晶片8的顶表面形成为凸形或凹形弯曲形状的转印托盘可以插入在晶片8和顶表面平坦的卡盘顶部9之间。

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