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    • 4. 发明授权
    • Scratch-resistant articles with retained optical properties
    • 具有保留光学性能的耐刮擦物品
    • US09110230B2
    • 2015-08-18
    • US14267516
    • 2014-05-01
    • CORNING INCORPORATED
    • Karl William Koch, IIICharles Andrew Paulson
    • G02B1/10C03C17/245C03C17/34C23C14/34
    • C03C17/3435C03C3/091C03C17/245C03C17/3411C03C21/002C03C2217/78C03C2217/91C23C14/34C23C14/3442G02B1/10G02B1/105G02B1/14Y10T428/2495Y10T428/31612
    • One or more aspects of the disclosure pertain to an article including an optical film structure disposed on an inorganic oxide substrate, which may include a strengthened or non-strengthened substrate that may be amorphous or crystalline, such that the article exhibits scratch resistance and retains the same or improved optical properties as the inorganic oxide substrate, without the optical film structure disposed thereon. In one or more embodiments, the article exhibits an average transmittance of 85% or more, over the visible spectrum (e.g., 380 nm-780 nm). Embodiments of the optical film structure include aluminum-containing oxides, aluminum-containing oxy-nitrides, aluminum-containing nitrides (e.g., AlN) and combinations thereof. The optical film structures disclosed herein also include a transparent dielectric including oxides such as silicon oxide, germanium oxide, aluminum oxide and a combination thereof. Methods of forming such articles are also provided.
    • 本公开的一个或多个方面涉及包括设置在无机氧化物基底上的光学膜结构的物品,其可以包括可以是无定形或结晶的强化或非加强基底,使得该制品具有耐刮擦性并保持 与无机氧化物衬底相同或改善的光学性质,其中没有设置光学膜结构。 在一个或多个实施方案中,制品在可见光谱(例如,380nm-780nm)上显示85%或更多的平均透射率。 光学膜结构的实施例包括含铝氧化物,含铝氧化物,含铝氮化物(例如AlN)及其组合。 本文公开的光学膜结构还包括包括氧化物如氧化硅,氧化锗,氧化铝及其组合的透明电介质。 还提供了形成这种制品的方法。
    • 7. 发明申请
    • Methods for forming superconducting conductors
    • 形成超导导体的方法
    • US20100065417A1
    • 2010-03-18
    • US11287770
    • 2005-11-28
    • Venkat Selvamanickam
    • Venkat Selvamanickam
    • C23C14/34B05D5/12
    • C23C14/3442C23C14/024C23C14/087H01L39/2461
    • A method for producing a superconducting conductor is disclosed, including providing a substrate, depositing a buffer film having a biaxial texture to overlie the substrate by reactive sputtering, and depositing a superconducting layer to overlie the buffer film. Deposition of the buffer film is carried out by exposing the substrate along a deposition zone to a material plume generated by bombarding a target in the presence of a magnetic field, the deposition zone having a length of at least 1.0 m. The assist ions may be generated from a gridless ion source. The buffer film may have a biaxial texture having an out-of-plane crystallographic texture represented by a mosaic spread of not greater than 30°.
    • 公开了一种用于制造超导体的方法,包括提供衬底,通过反应溅射沉积具有双轴纹理的缓冲膜覆盖在衬底上,以及沉积超导层以覆盖缓冲膜。 缓冲膜的沉积是通过将衬底沿着沉积区暴露于通过在存在磁场的情况下轰击靶而产生的材料羽流而进行的,该沉积区的长度至少为1.0μm。 辅助离子可以从无电子离子源产生。 缓冲膜可以具有由不大于30°的马赛克扩展表示的面外晶体结构的双轴纹理。
    • 10. 发明申请
    • METHOD FOR MANUFACTURING A MAGNETIC TUNNEL JUNCTION SENSOR USING ION BEAM DEPOSITION
    • 使用离子束沉积制造磁性隧道结传感器的方法
    • US20080210544A1
    • 2008-09-04
    • US11848104
    • 2007-08-30
    • Mustafa Michael Pinarbasi
    • Mustafa Michael Pinarbasi
    • C23C14/34
    • G11B5/3909B82Y10/00B82Y25/00B82Y40/00C23C14/081C23C14/3442C23C14/46G01R33/093G01R33/098G11B5/3163G11B5/3906H01F10/3254H01F41/18H01F41/307
    • A method for forming a MgOx barrier layer in a magnetic tunnel junction (MTJ) sensor, also known in the art as a tunneling magnetoresistance (TMR) sensor. The MgOx barrier layer is deposited by an ion beam deposition (IBD) process that results in a MgOx barrier layer having exceptional, uniform properties and a well-controlled oxygen content. The ion beam deposition of the barrier layer includes placing a wafer into an ion beam deposition (IBD) chamber provided with a Mg target. An ion beam from an ion gun is directed at the target thereby sputtering Mg atoms from the target for deposition onto the wafer. Oxygen is admitted into the chamber as one or both of two species: molecular oxygen, O2, admitted through a gas inlet, and oxygen ions, admitted through a second ion gun, The use of ion beam deposition avoids oxygen poisoning of the Mg target, such as would occur using a more conventional plasma vapor deposition (PVD) technique.
    • 在磁性隧道结(MTJ)传感器中形成MgO 阻挡层的方法,在本领域中也称为隧道磁阻(TMR)传感器。 通过离子束沉积(IBD)工艺沉积MgO xSOS阻挡层,其导致具有特别均匀性质的氧化镁阻挡层和良好控制的氧含量 。 阻挡层的离子束沉积包括将晶片放置在设置有Mg靶的离子束沉积(IBD)室中。 来自离子枪的离子束被引导到靶,从而溅射来自靶的Mg原子以沉积到晶片上。 氧气作为两种物质之一或两者进入腔室:通过气体入口进入的分子氧O 2和通过第二离子枪进入的氧离子。使用离子束沉积 避免了Mg靶的氧中毒,例如使用更传统的等离子体气相沉积(PVD)技术发生的氧中毒。