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1. 发明申请

US20190086558A1 RADIATION IMAGE ACQUISITION DEVICE 审中-公开
公开(公告)号：US20190086558A1
公开(公告)日：2019-03-21
申请号：US16101967
申请日：2018-08-13
申请人： HAMAMATSU PHOTONICS K.K.
发明人： Mototsugu SUGIYAMA , Toshiyasu SUYAMA
IPC分类号： G01T1/20 , G01N23/04
CPC分类号： G01T1/2002 , G01N23/04 , G01N2223/611 , G01T1/20 , G01T1/2006
摘要： A radiation image acquisition device includes: a radiation source which emits radiation; a wavelength conversion member of a flat plate shape which generates scintillation light according to incidence of the radiation emitted from the radiation source and transmitted by an object; first imaging means which condenses and images the scintillation light emitted from an entrance surface for the radiation in the wavelength conversion member; and second imaging means which condenses and images the scintillation light emitted from a surface opposite to the entrance surface in the wavelength conversion member, wherein one of the first imaging means and the second imaging means condenses the scintillation light emitted from the entrance surface or the opposite surface in a direction of a normal thereto, and wherein the other of the first imaging means and the second imaging means condenses the scintillation light emitted from the entrance surface or the opposite surface in a direction inclined with respect to a direction of a normal thereto.

2. 发明授权

US10054432B2 X-ray inspection apparatus and control method 有权
公开(公告)号：US10054432B2
公开(公告)日：2018-08-21
申请号：US15685031
申请日：2017-08-24
申请人： OMRON Corporation
发明人： Hironori Kasahara , Shinji Sugita , Takako Onishi
IPC分类号： G01B11/00 , G01B11/25 , H04N13/282 , G06T7/55 , G01N23/083 , G01N23/18 , G01N23/223 , G01S15/89 , G06T7/00 , H04N13/02 , G01N23/046
CPC分类号： G01B11/2527 , G01N23/044 , G01N23/046 , G01N23/083 , G01N23/18 , G01N23/223 , G01N2223/611 , G01N2223/645 , G01N2223/646 , G01S15/8925 , G06T7/0002 , G06T7/55 , H04N13/282
摘要： An X-ray inspection apparatus includes a 3D processing unit that performs 3D imaging of a first area in an inspection area, a 2D processing unit that performs 2D imaging of a second area in the inspection area, an extraction unit that extracts 3D information for a first inspection target from a 3D image of the first area, and 2D information for a second inspection target from a 2D image of the second area, a 3D information estimation unit that estimates 3D information for the second inspection target using the extracted 3D information for the first inspection target, and an inspection unit that inspects the second inspection target using the 2D information for the second inspection target and the estimated 3D information for the second inspection target.

3. 发明申请

US20180096904A1 CAPACITANCE MONITORING USING X-RAY DIFFRACTION 有权
公开(公告)号：US20180096904A1
公开(公告)日：2018-04-05
申请号：US15831810
申请日：2017-12-05
申请人： International Business Machines Corporation
发明人： Donghun Kang , Kriteshwar K. Kohli , Oh-jung Kwon , Anita Madan , Conal E. Murray
IPC分类号： H01L21/66 , G01N23/20 , G01R31/265
CPC分类号： H01L22/14 , G01N23/20 , G01N23/207 , G01N2223/0566 , G01N2223/607 , G01N2223/611 , G01R31/2656 , H01L22/12
摘要： A method includes measuring a difference between a primary X-ray diffraction peak and a secondary X-ray diffraction peak, the primary X-ray diffraction peak corresponds to an unstrained portion of a semiconductor substrate and the secondary X-ray diffraction peak corresponds to a strained portion of the semiconductor substrate, the difference between the primary X-ray diffraction peak and the secondary X-ray diffraction peak includes a delta shift peak that corresponds to changes in a crystal lattice caused by a stress applied to the strained portion of the semiconductor substrate, the delta shift peak includes variations in a deep trench capacitance.

4. 发明申请

US20160343123A1 ALIGNMENT FILM DETECTING DEVICE AND ALIGNMENT FILM DETECTING METHOD 审中-公开
标题翻译：对准膜检测装置和对准膜检测方法
公开(公告)号：US20160343123A1
公开(公告)日：2016-11-24
申请号：US15098384
申请日：2016-04-14
申请人： BOE TECHNOLOGY GROUP CO., LTD. , HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Yangkun JING , Changjun JIANG
IPC分类号： G06T7/00
CPC分类号： G02F1/13 , G01N23/18 , G01N2223/611 , G01N2223/646 , G02F1/1309 , G02F1/133784 , G06T7/0006 , G06T2207/10116 , G06T2207/30121
摘要： The present disclosure provides in some embodiments an alignment film detecting device including: an imaging unit configured to obtain image information of the alignment grooves on the alignment film of the substrate; and an image processing unit configured to determine whether there is a defect in the alignment grooves on the alignment film based on the image information. According to the alignment film detecting device and the alignment film detecting method provided the present disclosure, the defect of the alignment film on the substrate may be detected, and the image information of the alignment grooves on the alignment film of the substrate may be obtained by the imaging unit, and a recognizing process may be implemented by the image processing unit based on the image information, so that it may accurately determine whether there is a defect in the alignment grooves. As compared with a method of manually detecting the defect in the alignment grooves by vapor in a conventional alignment film detecting technique, it may overcome disadvantages of manually detecting the defect in the alignment grooves of the substrate, such as low recognition rate, being vulnerable to false detection, and inefficient detection, so as to improve detection efficiency as well as accuracy and credibility of the detection result.
摘要翻译：本公开在一些实施方案中提供了一种取向膜检测装置，包括：成像单元，被配置为获得所述基板的取向膜上的对准槽的图像信息; 以及图像处理单元，被配置为基于图像信息来确定取向膜上的对准槽是否存在缺陷。根据本公开的取向膜检测装置和取向膜检测方法，可以检测基板上的取向膜的缺陷，并且可以通过以下方式获得基板的取向膜上的对准槽的图像信息：成像单元和识别处理可以由图像处理单元基于图像信息来实现，使得其可以准确地确定对准凹槽中是否存在缺陷。与以往的取向膜检测技术中通过蒸汽手动检测对准槽的缺陷的方法相比，可以克服手动检测基板的对准槽中的缺陷的缺点，例如低识别率，易受到错误检测和低效检测，从而提高检测效率以及检测结果的准确性和可信度。

5. 发明申请

US20160307726A1 INSPECTION DEVICE 审中-公开
标题翻译：检查装置
公开(公告)号：US20160307726A1
公开(公告)日：2016-10-20
申请号：US15195665
申请日：2016-06-28
申请人： EBARA CORPORATION
发明人： Masahiro Hatakeyama , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Yoshihiko Naito , Yasushi Toma , Tsutomu Karimata , Takehide Hayashi , Kiwamu Tsukamoto , Tatsuya Kohama , Noboru Kobayashi
IPC分类号： H01J37/09 , G01N23/225 , H01J37/28 , H01J37/22 , H01J37/10
CPC分类号： H01J37/073 , G01N23/22 , G01N23/223 , G01N23/2251 , G01N2223/611 , H01J1/34 , H01J37/09 , H01J37/10 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/265 , H01J37/28 , H01J37/29 , H01J2237/0048 , H01J2237/022 , H01J2237/032 , H01J2237/038 , H01J2237/045 , H01J2237/0458 , H01J2237/0473 , H01J2237/0492 , H01J2237/061 , H01J2237/06333 , H01J2237/166 , H01J2237/186 , H01J2237/2002 , H01J2237/2007 , H01J2237/2008 , H01J2237/2448 , H01J2237/2482 , H01J2237/2485 , H01J2237/2817 , H01J2237/2855 , H01J2237/2857
摘要： An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.
摘要翻译：用于使用光束检查检查对象的表面的检查装置包括能够产生电荷粒子或电磁波之一作为光束的光束发生器，能够将所述光束引导并照射到被检查对象的主光学系统在工作室内，能够包括第一可移动数值孔径的二次光学系统和检测从检查对象产生的二次电荷粒子的第一检测器，通过第一可移动数值孔径的二次电荷粒子，能够基于由所述第一检测器检测到的次级电荷粒子形成图像; 以及第二检测器，其布置在第一可移动数值孔径和第一检测器之间，并且检测在从检查对象生成的次级充电颗粒的交叉位置处的位置和形状。

6. 发明申请

US20160187849A1 Coherent Diffractive Imaging With Arbitrary Angle of Incidence 有权
$Coherent Diffractive Imaging With Arbitrary Angle of Incidence$
标题翻译：具有任意发生角度的相干衍射成像
公开(公告)号：US20160187849A1
公开(公告)日：2016-06-30
申请号：US14839738
申请日：2015-08-28
申请人： Bosheng Zhang , Matthew D. Seaberg , Daniel E. Adams , Henry C. Kapteyn , Margaret M. Murnane
发明人： Bosheng Zhang , Matthew D. Seaberg , Daniel E. Adams , Henry C. Kapteyn , Margaret M. Murnane
IPC分类号： G03H1/04 , G03H1/16
CPC分类号： G03H1/0443 , G01N21/4788 , G01N23/20 , G01N23/2055 , G01N2021/95676 , G01N2223/33 , G01N2223/345 , G01N2223/611 , G01N2223/6116 , G02B21/0016 , G02B27/4205 , G03F1/84 , G03F7/70625 , G03H1/0465 , G03H1/0866 , G03H1/16 , G03H2001/005 , G03H2001/0445 , G03H2001/0447 , G03H2001/045 , G03H2001/0456 , G03H2001/0473 , G03H2001/0825 , G03H2240/62 , G21K7/00 , G21K2207/005
摘要： Apparatus and methods for coherent diffractive imaging with arbitrary angle of illumination incidence utilize a method of fast remapping of a detected diffraction intensity pattern from a detector pixel array (initial grid) to a uniform spatial frequency grid (final grid) chosen to allow for FFT on the remapped pattern. This is accomplished by remapping the initial grid to an intermediate grid chosen to result in a final grid that is linear in spatial frequency. The initial grid is remapped (generally by interpolation) to the intermediate grid that is calculated to correspond to the final grid. In general, the initial grid (x,y) is uniform in space, the intermediate grid ({tilde over (x)},{tilde over (y)}) is non-uniform in spatial frequency, and the final grid ({tilde over (f)}x,{tilde over (f)}y) is uniform in spatial frequency.
摘要翻译：用于具有任意角度的照射入射的相干衍射成像的装置和方法利用将检测到的衍射强度图案从检测器像素阵列（初始栅格）快速重新映射到选择为允许FFT的均匀空间频率网格（最终网格）的方法重映射模式。这是通过将初始网格重新映射到选择的中间网格来实现的，以产生在空间频率中是线性的最终网格。将初始网格重新映射（通常通过内插）到计算为对应于最终网格的中间网格。通常，初始网格（x，y）在空间上是均匀的，中间网格（{tilde over（x）}，{tilde over（y）}）在空间频率上是不均匀的，并且最终网格（{ （f）} x，{tilde over（f）} y）的波浪号在空间频率上是均匀的。

7. 发明授权

US09291578B2 X-ray photoemission microscope for integrated devices 有权
标题翻译：用于集成器件的X射线照相显微镜
公开(公告)号：US09291578B2
公开(公告)日：2016-03-22
申请号：US13507895
申请日：2012-08-03
申请人： David L. Adler
发明人： David L. Adler
IPC分类号： G21K7/00 , G01N23/04
CPC分类号： G21K1/00 , G01N23/04 , G01N2223/1006 , G01N2223/611 , G21K7/00 , H01J1/78 , H01L23/49827 , H01L27/0203
摘要： An apparatus is disclosed for the examination and inspection of integrated devices such as integrated circuits. X-rays are transmitted through the integrated device, and are incident on a photoemissive structure that absorbs x-rays and emits electrons. The electrons emitted by the photoemissive structure are shaped by an electron optical system to form a magnified image of the emitted electrons on a detector. This magnified image is then recorded and processed. In some embodiments, the integrated device and photoemissive structure are independently mounted and controlled. In other embodiments, the photoemissive device is deposited directly onto the integrated device. In some embodiments, the incidence angle of the x-rays is varied to allow internal three-dimensional structures of the integrated device to be determined. In other embodiments, the recorded image is compared with a reference data to enable inspection for manufacturing quality control.
摘要翻译：公开了用于集成电路等集成装置的检查和检查的装置。 X射线通过集成器件传输，入射到吸收x射线并发射电子的光发射结构上。由发光结构发射的电子通过电子光学系统成形，以在检测器上形成发射电子的放大图像。然后记录和处理该放大的图像。在一些实施例中，集成装置和光发射结构被独立地安装和控制。在其他实施例中，光发射器件直接沉积在集成器件上。在一些实施例中，X射线的入射角度被改变以允许确定集成器件的内部三维结构。在其他实施例中，将记录的图像与参考数据进行比较，以使得能够进行制造质量控制的检查。

8. 发明申请

US20150300965A1 Scatterometry-Based Imaging and Critical Dimension Metrology 有权
标题翻译：基于Scatterometry的成像和关键尺寸计量学
公开(公告)号：US20150300965A1
公开(公告)日：2015-10-22
申请号：US14690442
申请日：2015-04-19
申请人： KLA-Tencor Corporation
发明人： Abdurrahman Sezginer , John Hench , Michael S. Bakeman
IPC分类号： G01N23/201
CPC分类号： G01N23/201 , G01N2223/611 , G01N2223/645 , H01L22/12
摘要： Methods and systems for performing measurements of semiconductor structures and materials based on scatterometry measurement data are presented. Scatterometry measurement data is used to generate an image of a material property of a measured structure based on the measured intensities of the detected diffraction orders. In some examples, a value of a parameter of interest is determined directly from the map of the material property of the measurement target. In some other examples, the image is compared to structural characteristics estimated by a geometric, model-based parametric inversion of the same measurement data. Discrepancies are used to update the geometric model of the measured structure and improve measurement performance. This enables a metrology system to converge on an accurate parametric measurement model when there are significant deviations between the actual shape of a manufactured structure subject to model-based measurement and the modeled shape of the structure.
摘要翻译：介绍了基于散射测量数据进行半导体结构和材料测量的方法和系统。散射测量测量数据用于基于检测到的衍射级的测量强度来生成测量结构的材料特性的图像。在一些示例中，直接从测量对象的材料属性的映射确定感兴趣的参数的值。在一些其他示例中，将图像与通过相同测量数据的几何，基于模型的参数反演估计的结构特征进行比较。差异用于更新测量结构的几何模型，并提高测量性能。当使基于模型的测量的制造结构的实际形状与结构的建模形状之间存在显着的偏差时，这使测量系统能够收敛于精确的参数测量模型。

9. 发明授权

US09046475B2 High electron energy based overlay error measurement methods and systems 有权
标题翻译：基于高电子能量的覆盖误差测量方法和系统
公开(公告)号：US09046475B2
公开(公告)日：2015-06-02
申请号：US13111838
申请日：2011-05-19
申请人： Moshe Langer , Ofer Adan , Ram Peltinov , Yoram Uziel , Ori Shoval
发明人： Moshe Langer , Ofer Adan , Ram Peltinov , Yoram Uziel , Ori Shoval
IPC分类号： G21K7/00 , G01N23/225
CPC分类号： G01N23/2251 , G01N2223/61 , G01N2223/611
摘要： A method, a system and a computer readable medium are provided. The method may include obtaining or receiving first area information representative of a first area of a first layer of an inspected object; wherein the inspected object further comprises a second layer that comprises a second area; wherein the second layer is buried under the first layer; directing electrons of a primary electron beam to interact with the first area; directing electrons of the primary electron beam to interact with the second area; generating detection signals responsive to electrons that were scattered or reflected from at least one of the first and second areas; and determining at least one spatial relationship between at least one feature of the first area and at least one feature of the second area based on the detection signals and on the first area information.
摘要翻译：提供了一种方法，系统和计算机可读介质。该方法可以包括获得或接收表示被检查对象的第一层的第一区域的第一区域信息; 其中被检查物体还包括包括第二区域的第二层; 其中所述第二层被埋在所述第一层下面; 引导一次电子束的电子与第一区域相互作用; 引导所述一次电子束的电子与所述第二区域相互作用; 产生响应于从第一和第二区域中的至少一个散射或反射的电子的检测信号; 以及基于所述检测信号和所述第一区域信息，确定所述第一区域的至少一个特征与所述第二区域的至少一个特征之间的至少一个空间关系。

10. 发明申请

US20150097116A1 INSPECTION APPARATUS 审中-公开
标题翻译：检查装置
公开(公告)号：US20150097116A1
公开(公告)日：2015-04-09
申请号：US14571594
申请日：2014-12-16
申请人： EBARA CORPORATION
发明人： Masahiro HATAKEYAMA , Yasushi TOMA , Shoji YOSHIKAWA , Kiwamu TSUKAMOTO
IPC分类号： H01J37/22 , H01J37/28
CPC分类号： H01J37/22 , G01N23/2251 , G01N2223/204 , G01N2223/611 , H01J3/024 , H01J37/075 , H01J37/28 , H01J2237/063 , H01J2237/2448 , H01J2237/2806
摘要： An inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The primary optical system includes a photoelectron generator having a photoelectronic surface. The base material of the photoelectronic surface is made of material having a higher thermal conductivity than the thermal conductivity of quartz.
摘要翻译：检查装置包括：用于产生任何带电粒子和电磁波作为光束的光束产生装置; 主光学系统，其将光束引导到保持在工作室中的检查对象中，并用该光束照射检查对象; 第二光学系统，其检测从检查对象发生的次级带电粒子; 以及基于检测到的二次带电粒子形成图像的图像处理系统。主光学系统包括具有光电子表面的光电子发生器。光电子表面的基材由具有比石英热导率更高的导热性的材料制成。

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