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    • 1. 发明授权
    • Crystal pulling apparatus and method for the production of heavy crystals
    • 水晶拉制装置及重晶体生产方法
    • US07828897B2
    • 2010-11-09
    • US11881023
    • 2007-07-25
    • Burkhard AltekrügerStefan HenkelAxel VonhoffErich TomzigDieter Knerer
    • Burkhard AltekrügerStefan HenkelAxel VonhoffErich TomzigDieter Knerer
    • C30B15/02
    • C30B15/32Y10S117/911Y10T117/10Y10T117/1032Y10T117/1068Y10T117/1072
    • A pulling apparatus and a method with which especially heavy crystals (5) can be pulled using the Czochralski method utilizing the pulling apparatus. For this purpose the neck (4) of the crystal (5) has an enlargement (10) beneath which extends the support device. This device includes latches (7), which are moved from a resting position into an operating position in which the latches (7) extend beneath the enlargement (10). Each latch (7) is supported on the base body such that it is swivellable about a pivot axis (8) and can assume two stable positions, namely the resting position and the operating position. Each of these positions is defined by a stop on the base body. When the latch rests on the one stop, its center of gravity, viewed from the neck (4), is located on the other side of the pivot axis (8). When the latch rests on the other stop, the center of gravity is located on this side of the pivot axis (8). The actuation of the latches (7) takes place with actuation means disposed stationarily in the apparatus.
    • 拉伸装置和使用拉伸装置的切克劳斯基法可以拉伸特别重的晶体(5)的方法。 为此,晶体(5)的颈部(4)具有放大(10),在该放大部分(10)延伸支撑装置。 该装置包括闩锁(7),其从静止位置移动到闩锁(7)在放大部分(10)下方延伸的操作位置。 每个闩锁(7)被支撑在基体上,使得其可绕枢转轴线(8)旋转并且可以呈现两个稳定的位置,即静止位置和操作位置。 这些位置中的每一个由基体上的止挡限定。 当闩锁位于一个停止点上时,从颈部(4)观察的其重心位于枢转轴线(8)的另一侧。 当闩锁位于另一个挡块上时,重心位于枢转轴线(8)的这一侧。 闩锁(7)的致动通过固定地设置在该装置中的致动装置进行。
    • 2. 发明授权
    • Methods of fabricating silicon carbide crystals
    • 制造碳化硅晶体的方法
    • US07501022B2
    • 2009-03-10
    • US11542987
    • 2006-10-04
    • Stephan Mueller
    • Stephan Mueller
    • C30B28/12
    • C30B23/00C30B23/025C30B29/36Y10S117/911
    • Methods for producing silicon carbide crystals, seed crystal holders and seed crystal for use in producing silicon carbide crystals and silicon carbide crystals are provided. Silicon carbide crystals are produced by forcing nucleation sites of a silicon carbide seed crystal to a predefined pattern and growing silicon carbide utilizing physical vapor transport (PVT) so as to provide selective preferential growth of silicon carbide corresponding to the predefined pattern. Seed holders and seed crystals are provided for such methods. Silicon carbide crystals having regions of higher and lower defect density are also provided.
    • 提供了用于生产碳化硅晶体和碳化硅晶体的碳化硅晶体,晶种保持器和晶种的制造方法。 通过将碳化硅晶种的成核位置强制为预定图案并利用物理气相传输(PVT)生长碳化硅以便提供对应于预定图案的碳化硅的选择性优先生长来制造碳化硅晶体。 为这种方法提供种子保持器和晶种。 还提供了具有更高和更低缺陷密度区域的碳化硅晶体。
    • 5. 发明申请
    • DEVICE FOR PRODUCING THE GROWTH OF A SEMICONDUCTOR MATERIAL
    • 用于生产半导体材料生长的装置
    • US20080163815A1
    • 2008-07-10
    • US11972111
    • 2008-01-10
    • Sylvain Paltrier
    • Sylvain Paltrier
    • C30B11/00
    • C30B11/003C30B11/00C30B11/002C30B11/14C30B15/22C30B29/10C30B29/48H01L21/02376H01L21/02428H01L21/02562H01L21/02625H01L21/02645Y10S117/911Y10T117/1024
    • This device for producing the growth of a semiconductor material, in particular of type II-VI, uses a melt of the said semiconductor placed in a sealed bulb under vacuum or under controlled atmosphere, the said bulb being subjected to a sufficient temperature gradient for first maintaining the melt in the liquid state, then causing its progressive crystallization from the surface towards the bottom.The said device further comprises an element (3) capable of floating on the surface of the said melt, and equipped with a substantially central bore (4), intended on the one hand for receiving a seed crystal (5) or for permitting the nucleation leading to the preparation of a seed crystal (5′), and also of supporting the said seed crystal (5, 5′) above the melt while maintaining it in contact with the said melt in order to permit the continued crystallization from the said seed crystal (5, 5′) by lowering the temperature gradient.
    • 用于产生半导体材料,特别是II-VI型的生长的该器件使用在真空或受控气氛下将密封的灯泡放置在密封灯泡中的熔体,所述灯泡经受足够的温度梯度 将熔体保持在液态,然后使其从表面向底部逐渐结晶。 所述装置还包括能够漂浮在所述熔体的表面上并且装备有基本中心孔(4)的元件(3),一方面用于接收晶种(5)或用于允许成核 导致制备晶种(5'),并且还使熔体上方的所述晶种(5,5')支撑,同时保持其与所述熔体接触,以便允许从所述种子继续结晶 通过降低温度梯度来测量晶体(5,5')。
    • 6. 发明授权
    • Crucible or related object holder and method of manufacture
    • 坩埚或相关物体夹持器和制造方法
    • US07232489B2
    • 2007-06-19
    • US11180162
    • 2005-07-13
    • Olivia Webb
    • Olivia Webb
    • C30B35/00
    • B01L9/50B01L3/04B25B9/00B25B9/02Y10S117/911Y10T117/10Y10T117/1032Y10T117/1052Y10T117/1068Y10T117/1072Y10T117/1088
    • An apparatus for holding a crucible or other item is provided. The apparatus includes a first support member having a straight portion with two ends. A second support member having a shaped portion is connected to one of the ends of the first support member, wherein the shape of the shaped portion accommodates the crucible or other item. A support material covers the second support member, wherein the support material increases the coefficient of friction between the crucible or other item and the second support member. A spring is coupled to the other end of the first support member, and a third support member is coupled to the spring and configured so as to apply a force to the crucible or other item when the crucible or other item is placed in the shaped portion of the second support member. The third support member can be moved by exerting a force opposite to that applied by the spring so as to allow the crucible or other item to be placed in the shaped portion of the second support member, and when the exerted force is removed, the third support member is placed in contact with the crucible or other item by the spring force, such as to hold the crucible without exceeding the amount of force that would break the crucible or other item.
    • 提供了一种用于保持坩埚或其它物品的装置。 该装置包括具有两端的直线部分的第一支撑构件。 具有成形部分的第二支撑构件连接到第一支撑构件的一个端部,其中成形部分的形状容纳坩埚或其它物品。 支撑材料覆盖第二支撑构件,其中支撑材料增加了坩埚或其它物品与第二支撑构件之间的摩擦系数。 弹簧联接到第一支撑构件的另一端,并且第三支撑构件联接到弹簧并且构造成当坩埚或其它物品放置在成形部分中时向坩埚或其它物品施加力 的第二支撑构件。 可以通过施加与弹簧施加的力相反的力来移动第三支撑构件,以便允许坩埚或其它物品放置在第二支撑构件的成形部分中,并且当施加的力被移除时,第三支撑构件 支撑构件通过弹簧力与坩埚或其他物体接触,例如保持坩埚而不超过破坏坩埚或其它物品的力的量。
    • 10. 发明授权
    • Argon/ammonia rapid thermal annealing for silicon wafers
    • 氩/氨快速热退火硅片
    • US06780238B2
    • 2004-08-24
    • US10235023
    • 2002-09-04
    • Jea-gun Park
    • Jea-gun Park
    • C30B2502
    • C30B29/06C30B15/14C30B15/203C30B15/206C30B33/00H01L21/3225Y10S117/911Y10T117/1004Y10T117/1008Y10T117/1052Y10T117/1068Y10T117/1072Y10T117/1088Y10T428/12458Y10T428/12528Y10T428/21
    • A silicon wafer is provided having controlled distribution of defects, in which denuded zones having a sufficient depth inward from the surface of the wafer are combined with a high gettering effect in a bulk region of the wafer. In the silicon wafer, oxygen precipitates, which act as intrinsic gettering sites, show vertical distribution. The oxygen precipitate concentration profile from the top to the bottom surfaces of the wafer includes first and second peaks at first and second predetermined depths from the top and bottom surfaces of the wafer, denuded zones between the top and bottom surfaces of the wafer and each of the first and second peaks, and a concave region between the first and second peaks, which corresponds to a bulk region of the wafer. For such an oxygen precipitate concentration profile, the wafer is exposed to a rapid thermal annealing process in a gas mixture atmosphere comprising ammonia (NH3) and argon (Ar) at temperatures below about 1200° C. Using such a rapid thermal annealing process, slip dislocation can be reduced in the device regions of the wafer, and silicon dioxide sublimation on the rapid thermal annealing chamber also can be reduced.
    • 提供了具有受控的缺陷分布的硅晶片,其中具有从晶片表面向内的足够深度的裸露区域在晶片的主体区域中与高吸杂效应组合。 在硅晶片中,作为固有吸气部位的氧析出物显示垂直分布。 从晶片的顶表面到底表面的氧沉淀浓度分布包括在晶片的顶表面和底表面的第一和第二预定深度处的第一和第二峰,在晶片的顶表面和底表面之间的裸露区域 第一和第二峰,以及在第一和第二峰之间的对应于晶片的体区的凹区。 对于这样的氧沉淀浓度分布,在低于约1200℃的温度下,在包含氨(NH 3)和氩(Ar)的气体混合气体中将晶片暴露于快速热退火工艺。使用这种快速热退火工艺,滑动 可以在晶片的器件区域中减少位错,并且可以减少快速热退火室上的二氧化硅升华。