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1. 发明授权

US08884797B2 Systems and methods providing active and passive charge sharing in a digital to analog converter 有权
标题翻译：在数模转换器中提供有源和无源电荷共享的系统和方法
公开(公告)号：US08884797B2
公开(公告)日：2014-11-11
申请号：US13035444
申请日：2011-02-25
申请人： Yung-Chow Peng , Jui-Cheng Huang , Ching-Ho Chang , Nang Ping Tu
发明人： Yung-Chow Peng , Jui-Cheng Huang , Ching-Ho Chang , Nang Ping Tu
IPC分类号： H03M1/66 , H03M1/68 , G09G3/36 , H03M1/80
CPC分类号： H03M1/68 , G09G3/3688 , G09G2300/023 , G09G2310/027 , G09G2330/023 , H03M1/804
摘要： A method for converting a multi-bit digital value to an analog value. The method includes, in a first conversion cycle, converting a first set of digital bits to a first analog voltage using passive charge-sharing. The method also includes, in a second conversion cycle, converting a second set of digital bits to a second analog voltage added to the first analog voltage using active charge-sharing. The first set of digital bits and the second set of digital bits are different bits of the multi-bit digital value.
摘要翻译：一种用于将多位数字值转换为模拟值的方法。该方法包括在第一转换周期中，使用无源电荷共享将第一组数字位转换为第一模拟电压。该方法还包括在第二转换周期中，使用有源电荷共享将第二组数字位转换为添加到第一模拟电压的第二模拟电压。第一组数字位和第二组数字位是多位数字值的不同位。

2. 发明申请

US20120218235A1 Systems And Methods Providing Active And Passive Charge Sharing In A Digital To Analog Converter 有权
标题翻译：在数模转换器中提供主动和被动电荷共享的系统和方法
公开(公告)号：US20120218235A1
公开(公告)日：2012-08-30
申请号：US13035444
申请日：2011-02-25
申请人： Yung-Chow Peng , Jui-Cheng Huang , Ching-Ho Chang , Nang Ping Tu
发明人： Yung-Chow Peng , Jui-Cheng Huang , Ching-Ho Chang , Nang Ping Tu
IPC分类号： G06F3/038 , G09G3/36 , H03M1/66
CPC分类号： H03M1/68 , G09G3/3688 , G09G2300/023 , G09G2310/027 , G09G2330/023 , H03M1/804
摘要： A method for converting a multi-bit digital value to an analog value. The method includes, in a first conversion cycle, converting a first set of digital bits to a first analog voltage using passive charge-sharing. The method also includes, in a second conversion cycle, converting a second set of digital bits to a second analog voltage added to the first analog voltage using active charge-sharing. The first set of digital bits and the second set of digital bits are different bits of the multi-bit digital value.
摘要翻译：一种用于将多位数字值转换为模拟值的方法。该方法包括在第一转换周期中，使用无源电荷共享将第一组数字位转换为第一模拟电压。该方法还包括在第二转换周期中，使用有源电荷共享将第二组数字位转换为添加到第一模拟电压的第二模拟电压。第一组数字位和第二组数字位是多位数字值的不同位。

3. 发明授权

US09383264B2 Small area high performance cell-based thermal diode 有权
标题翻译：小面积高性能基于电池的热二极管
公开(公告)号：US09383264B2
公开(公告)日：2016-07-05
申请号：US13428549
申请日：2012-03-23
申请人： Yung-Chow Peng , Ching-Ho Chang , Jui-Cheng Huang
发明人： Yung-Chow Peng , Ching-Ho Chang , Jui-Cheng Huang
IPC分类号： G01K7/00 , G01K7/01
CPC分类号： G01K7/01 , Y10T307/76
摘要： A thermal sensing system includes a circuit having a layout including standard cells arranged in rows and columns. First and second current sources provide first and second currents, respectively. The thermal sensing system includes thermal sensing units, first and second switching modules, and an analog to digital converter (ADC). Each thermal sensing unit is configured to provide a voltage drop dependent on a temperature at that thermal sensing unit. The first switching module is configured to select one of the thermal sensing units. The second switching module includes at least one switch controllable by a control signal. The at least one switch is configured to selectively couple the thermal sensing units, based on the control signal, to one of the first and second current sources, via the first switching module. The ADC is configured to convert an analog voltage, provided by the selected thermal sensing unit, to a digital value.
摘要翻译：热感测系统包括具有布置成行和列的标准单元的布局的电路。第一和第二电流源分别提供第一和第二电流。热感测系统包括热敏单元，第一和第二开关模块以及模数转换器（ADC）。每个热敏单元被配置成提供取决于该热感测单元处的温度的电压降。第一开关模块被配置为选择一个热感测单元。第二开关模块包括可由控制信号控制的至少一个开关。所述至少一个开关被配置为经由所述第一开关模块将所述热感测单元基于所述控制信号选择性地耦合到所述第一和第二电流源之一。 ADC配置为将所选热敏单元提供的模拟电压转换为数字值。

4. 发明授权

US09016939B2 Thermal sensor with second-order temperature curvature correction 有权
标题翻译：具有二阶温度曲率校正的热传感器
公开(公告)号：US09016939B2
公开(公告)日：2015-04-28
申请号：US13632498
申请日：2012-10-01
申请人： Ching-Ho Chang , Jui-Cheng Huang , Yung-Chow Peng
发明人： Ching-Ho Chang , Jui-Cheng Huang , Yung-Chow Peng
IPC分类号： G01K7/00 , G01K7/01
CPC分类号： G01K7/01 , G01K15/005
摘要： Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.
摘要翻译：本公开的一些实施例涉及具有检测一个或多个集成芯片的温度的热传感器的堆叠集成芯片结构。在一些实施例中，堆叠集成芯片结构具有位于插入器晶片上的主集成芯片和次集成芯片。主集成芯片具有产生偏置电流的参考电压源。次级集成芯片具有接收偏置电流的第二热二极管，并且基于此产生第二热感测电压和与次级集成芯片的温度成比例的第二参考电压。基于与第二热感测电压和参考电压的比较，主集成芯片内的数字热传感器确定二次集成芯片的温度。

5. 发明申请

US20140092939A1 Thermal Sensor with Second-Order Temperature Curvature Correction 有权
标题翻译：具有二阶温度曲率校正的热传感器
公开(公告)号：US20140092939A1
公开(公告)日：2014-04-03
申请号：US13632498
申请日：2012-10-01
申请人： Ching-Ho Chang , Jui-Cheng Huang , Yung-Chow Peng
发明人： Ching-Ho Chang , Jui-Cheng Huang , Yung-Chow Peng
IPC分类号： G01K7/01 , H01L23/544
CPC分类号： G01K7/01 , G01K15/005
摘要： Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.
摘要翻译：本公开的一些实施例涉及具有检测一个或多个集成芯片的温度的热传感器的堆叠集成芯片结构。在一些实施例中，堆叠集成芯片结构具有位于插入器晶片上的主集成芯片和次集成芯片。主集成芯片具有产生偏置电流的参考电压源。次级集成芯片具有接收偏置电流的第二热二极管，并且基于此产生第二热感测电压和与次级集成芯片的温度成比例的第二参考电压。基于与第二热感测电压和参考电压的比较，主集成芯片内的数字热传感器确定二次集成芯片的温度。

6. 发明授权

US08810268B2 Built-in self-test circuit for liquid crystal display source driver 有权
标题翻译：内置自检电路，用于液晶显示源驱动
公开(公告)号：US08810268B2
公开(公告)日：2014-08-19
申请号：US12764346
申请日：2010-04-21
申请人： Jui-Cheng Huang , Yung-Chow Peng , Ruey-Bin Sheen
发明人： Jui-Cheng Huang , Yung-Chow Peng , Ruey-Bin Sheen
IPC分类号： G01R31/3187
CPC分类号： G09G3/3685 , G09G3/006 , G09G2310/027 , G09G2310/0291 , G09G2330/12
摘要： A built-in self-test (BIST) circuit for a liquid crystal display (LCD) source driver includes at least one digital-to-analog converter (DAC) and at least one buffer coupled to the respective DAC, wherein the buffer is reconfigurable as a comparator. A first input signal and a second input signal are coupled to the comparator. The first input signal is a predetermined reference voltage level. The second input signal is a test offset voltage in a test range.
摘要翻译：用于液晶显示器（LCD）源驱动器的内置自检（BIST）电路包括至少一个数模转换器（DAC）和耦合到相应DAC的至少一个缓冲器，其中缓冲器可重新配置作为比较。第一输入信号和第二输入信号耦合到比较器。第一输入信号是预定的参考电压电平。第二输入信号是测试范围内的测试偏移电压。

7. 发明授权

US08762925B2 MEMS modeling system and method 有权
标题翻译： MEMS建模系统及方法
公开(公告)号：US08762925B2
公开(公告)日：2014-06-24
申请号：US13029942
申请日：2011-02-17
申请人： Tung-Tsun Chen , Yung-Chow Peng , Jui-Cheng Huang
发明人： Tung-Tsun Chen , Yung-Chow Peng , Jui-Cheng Huang
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , G06F17/5022 , G06F17/5068 , G06F2217/02 , G06F2217/06
摘要： A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.
摘要翻译：公开了一种用于对微机电装置进行建模的系统和方法。一个实施例包括将微机电设计分离成单独的区域并分别对分开的区域进行建模。参数化参数或参数方程可用于分开的模型。单独的模型可以集成到MEMS器件模型中。可以对MEMS器件模型进行测试和校准，然后可以用于为微机电器件的新设计建模。

8. 发明申请

US20120215497A1 MEMS Modeling System and Method 有权
标题翻译： MEMS建模系统与方法
公开(公告)号：US20120215497A1
公开(公告)日：2012-08-23
申请号：US13029942
申请日：2011-02-17
申请人： Tung-Tsun Chen , Yung-Chow Peng , Jui-Cheng Huang
发明人： Tung-Tsun Chen , Yung-Chow Peng , Jui-Cheng Huang
IPC分类号： G06F17/50 , G06F17/10 , G06G7/62
CPC分类号： G06F17/5081 , G06F17/5022 , G06F17/5068 , G06F2217/02 , G06F2217/06
摘要： A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.
摘要翻译：公开了一种用于对微机电装置进行建模的系统和方法。一个实施例包括将微机电设计分离成单独的区域并分别对分开的区域进行建模。参数化参数或参数方程可用于分开的模型。单独的模型可以集成到MEMS器件模型中。可以对MEMS器件模型进行测试和校准，然后可以用于为微机电器件的新设计建模。

9. 发明授权

US08022511B2 Semiconductor device packages with electromagnetic interference shielding 有权
标题翻译：具有电磁干扰屏蔽的半导体器件封装
公开(公告)号：US08022511B2
公开(公告)日：2011-09-20
申请号：US12336407
申请日：2008-12-16
申请人： Chi-Tsung Chiu , Chih-Pin Hung , Jui-Cheng Huang
发明人： Chi-Tsung Chiu , Chih-Pin Hung , Jui-Cheng Huang
IPC分类号： H01L23/552
CPC分类号： H01L24/97 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49805 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2221/68331 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) a grounding element disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface; (4) a package body disposed adjacent to the upper surface and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a lateral surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The grounding element corresponds to a remnant of a conductive bump, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
摘要翻译：这里描述的是具有EMI屏蔽和相关方法的半导体器件封装。在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）接地元件，其设置在所述基板单元的周边附近并从所述基板单元的上表面向上延伸; （3）邻近上表面设置的半导体器件; （4）与所述上表面相邻并且覆盖所述半导体器件和所述接地元件的封装体; 和（5）邻近封装体的外表面设置并电连接到接地元件的侧表面的EMI屏蔽。封装主体的侧表面基本上与衬底单元的侧表面对准。接地元件对应于导电凸块的残余物，并且提供了入射到EMI屏蔽上的接地电磁辐射的电路径。

10. 发明授权

US08569808B1 Temperature stabilitized MEMS 有权
标题翻译：温度稳定的MEMS
公开(公告)号：US08569808B1
公开(公告)日：2013-10-29
申请号：US13441134
申请日：2012-04-06
申请人： Tung-Tsun Chen , Chia-Hua Chu , Chung-Hsien Lin , Jui-Cheng Huang
发明人： Tung-Tsun Chen , Chia-Hua Chu , Chung-Hsien Lin , Jui-Cheng Huang
IPC分类号： H01L29/66
CPC分类号： H01L23/34 , B81B7/0096 , B81B2201/0278 , B81C1/0023 , H01L23/345 , H01L27/0629 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device with temperature control system. Embodiments of the device may include a MEMS chip including a first heater with a dedicated first temperature control loop and a CMOS chip including a second heater with a dedicated second temperature control loop. Each control loop may have a dedicated temperature sensor for controlling the thermal output of each heater. The first heater and sensor are disposed proximate to a MEMS device in the MEMS chip for direct heating thereof. The temperature of the MEMS chip and CMOS chip are independently controllable of each other via the temperature control loops.
摘要翻译：具有温度控制系统的半导体器件。该装置的实施例可以包括包括具有专用第一温度控制回路的第一加热器和包括具有专用第二温度控制回路的第二加热器的CMOS芯片的MEMS芯片。每个控制回路可以具有用于控制每个加热器的热输出的专用温度传感器。第一加热器和传感器靠近MEMS芯片中的MEMS器件设置，用于直接加热MEMS芯片。 MEMS芯片和CMOS芯片的温度可以通过温度控制回路彼此独立控制。

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