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    • 1. 发明申请
    • Micro-Electromechanical System Memory Device and Method of Making the Same
    • 微机电系统存储器及其制作方法
    • US20090134522A1
    • 2009-05-28
    • US12085506
    • 2006-11-22
    • Charles Gordon SmithRobert KazincziRobertus P. Van Kampen
    • Charles Gordon SmithRobert KazincziRobertus P. Van Kampen
    • H01L29/45H01L21/441
    • B81C1/00666B81B3/001B81B2203/0118B81C2201/0109G11C23/00
    • A method of manufacturing a non-volatile memory bitcell comprises the steps of depositing a first layer of conductive material on a substrate and patterning and etching the first layer of conductive material to form three non-linearly disposed electrodes. The method also comprises the steps of depositing a first layer of sacrificial material on the electrodes and the substrate and providing an elongate cantilever structure on the first layer of sacrificial material such that the cantilever structure and at least a portion of each electrode overlap each other. The method also includes the steps of depositing a second layer of sacrificial material on the cantilever structure and the first layer of sacrificial material and providing a capping layer on the second layer of sacrificial material and providing holes in the capping layer such that at least a portion of the second layer of sacrificial material is exposed. Finally, the method provides the step of removing the first and second layers of sacrificial material through the holes provided in the capping layer, thereby defining a cavity in which the cantilever structure is suspended.
    • 一种制造非易失性存储器位单元的方法包括以下步骤:将第一层导电材料沉积在衬底上,并对第一层导电材料进行图案化和蚀刻以形成三个非线性布置的电极。 该方法还包括以下步骤:在电极和衬底上沉积牺牲材料的第一层,并在第一牺牲材料层上提供细长的悬臂结构,使得悬臂结构和每个电极的至少一部分彼此重叠。 该方法还包括以下步骤:将第二层牺牲材料沉积在悬臂结构和第一牺牲材料层上,并在牺牲材料的第二层上提供覆盖层,并在封盖层中提供孔,使得至少一部分 的第二层牺牲材料被暴露。 最后,该方法提供了通过设置在覆盖层中的孔去除第一层和第二层牺牲材料的步骤,从而限定悬臂悬臂结构的空腔。
    • 2. 发明授权
    • Method of enclosing a micro-electromechanical element
    • 封闭微机电元件的方法
    • US07867886B2
    • 2011-01-11
    • US12085428
    • 2006-11-22
    • Charles Gordon SmithRobertus P. Van Kampen
    • Charles Gordon SmithRobertus P. Van Kampen
    • H01L21/445B81C1/00H01L23/525
    • B81C1/00333H01L23/5256H01L2924/0002H01L2924/00
    • A method, in a complementary metal oxide semiconductor fabrication process, of creating a layered housing containing a micro-electromechanical system device, the method comprising the steps of providing a cavity in at least one layer of the housing, the cavity being accessible through via holes in a layer of insulating material deposited thereon, and the layer of insulating material being covered by a thin film layer of conductive material. The method further comprises the step of hydrophobically treating at least a portion of the inner surface of the cavity. Finally the method comprises the steps of submerging the wafer in an electroplating solution and electroplating a conductive layer onto the thin film layer of conductive material such that the cavity remains free of electroplating solution.
    • 在互补金属氧化物半导体制造工艺中,制造包含微机电系统器件的分层壳体的方法,所述方法包括以下步骤:在所述壳体的至少一层中提供空腔,所述空腔可通过通孔 在其上沉积的绝缘材料层中,并且绝缘材料层被导电材料的薄膜层覆盖。 该方法还包括对空腔的内表面的至少一部分进行疏水处理的步骤。 最后,该方法包括以下步骤:将晶片浸入电镀溶液中,并将导电层电镀到导电材料的薄膜层上,使得空腔保持不含电镀溶液。
    • 3. 发明申请
    • Method of Enclosing a Micro-Electromechanical Element
    • 封闭微机电元件的方法
    • US20090298215A1
    • 2009-12-03
    • US12085428
    • 2006-11-22
    • Charles Gordon SmithRobertus P. Van Kampen
    • Charles Gordon SmithRobertus P. Van Kampen
    • H01L21/50
    • B81C1/00333H01L23/5256H01L2924/0002H01L2924/00
    • A method, in a complementary metal oxide semiconductor fabrication process, of creating a layered housing containing a micro-electromechanical system device, the method comprising the steps of providing a cavity in at least one layer of the housing, the cavity being accessible through via holes in a layer of insulating material deposited thereon, and the layer of insulating material being covered by a thin film layer of conductive material. The method further comprises the step of hydrophobically treating at least a portion of the inner surface of the cavity. Finally the method comprises the steps of submerging the wafer in an electroplating solution and electroplating a conductive layer onto the thin film layer of conductive material such that the cavity remains free of electroplating solution.
    • 在互补金属氧化物半导体制造工艺中,制造包含微机电系统器件的分层壳体的方法,所述方法包括以下步骤:在所述壳体的至少一层中提供空腔,所述空腔可通过通孔 在其上沉积的绝缘材料层中,并且绝缘材料层被导电材料的薄膜层覆盖。 该方法还包括对空腔的内表面的至少一部分进行疏水处理的步骤。 最后,该方法包括以下步骤:将晶片浸入电镀溶液中,并将导电层电镀到导电材料的薄膜层上,使得空腔保持不含电镀溶液。
    • 4. 发明授权
    • Fabrication of a floating rocker MEMS device for light modulation
    • 用于光调制的浮动摇臂MEMS装置的制造
    • US08488230B2
    • 2013-07-16
    • US12862036
    • 2010-08-24
    • Charles Gordon SmithRichard L. Knipe
    • Charles Gordon SmithRichard L. Knipe
    • G02B26/00
    • G02B26/0833B81B2201/042B81C1/00317B81C2203/0136B81C2203/0145G02B26/0841
    • The current disclosure shows how to make a fast switching array of mirrors for projection displays. Because the mirror does not have a via in the middle connecting to the underlying spring support, there is an improved contrast ratio that results from not having light scatter off the legs or vias like existing technologies. Because there are no supporting contacts, the mirror can be made smaller making smaller pixels that can be used to make higher density displays. In addition, because there is not restoring force from any supporting spring support, the mirror stays in place facing one or other direction due to adhesion. This means there is no need to use a voltage to hold the mirror in position. This means that less power is required to run the display.
    • 目前的公开内容显示了如何制造用于投影显示器的反射镜的快速切换阵列。 因为反射镜在连接到下面的弹簧支撑件的中间没有通孔,所以具有改善的对比度,这是由于不像现有技术那样从腿部或通孔没有光散射。 因为没有支撑触点,镜子可以做得更小,从而可以用较小的像素来制作更高密度的显示器。 另外,由于没有来自任何支撑弹簧支撑件的恢复力,因为粘附,反射镜保持在面向一个或另一个方向的位置。 这意味着不需要使用电压将镜子保持在适当的位置。 这意味着运行显示器需要较少的电力。