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    • 44. 发明申请
    • ISOLATED TRI-GATE TRANSISTOR FABRICATED ON BULK SUBSTRATE
    • 隔离三极晶体管在大块基板上制作
    • US20090020792A1
    • 2009-01-22
    • US11779284
    • 2007-07-18
    • Rafael RiosJack KavalierosStephen M. Cea
    • Rafael RiosJack KavalierosStephen M. Cea
    • H01L29/78H01L21/02
    • H01L29/66795H01L29/785
    • A method of forming an isolated tri-gate semiconductor body comprises patterning a bulk substrate to form a fin structure, depositing an insulating material around the fin structure, recessing the insulating material to expose a portion of the fin structure that will be used for the tri-gate semiconductor body, depositing a nitride cap over the exposed portion of the fin structure to protect the exposed portion of the fin structure, and carrying out a thermal oxidation process to oxidize an unprotected portion of the fin structure below the nitride cap. The oxidized portion of the fin isolates the semiconductor body that is being protected by the nitride cap. The nitride cap may then be removed. The thermal oxidation process may comprise annealing the substrate at a temperature between around 900° C. and around 1100° C. for a time duration between around 0.5 hours and around 3 hours.
    • 形成隔离的三栅极半导体器件的方法包括:图案化块状衬底以形成翅片结构,在鳍结构周围沉积绝缘材料,使绝缘材料凹陷以暴露将用于三极管的鳍结构的一部分 - 半导体本体,在所述鳍结构的暴露部分上沉积氮化物帽以保护所述鳍结构的暴露部分,以及执行热氧化工艺以将所述鳍状结构的未受保护的部分氧化在所述氮化物帽下方。 翅片的氧化部分隔离被氮化物盖保护的半导体主体。 然后可以去除氮化物盖。 热氧化过程可以包括在大约900℃和大约1100℃之间的温度下退火约0.5小时至约3小时的时间。
    • 45. 发明授权
    • Integrated circuit with dynamic threshold voltage
    • 具有动态阈值电压的集成电路
    • US06489655B2
    • 2002-12-03
    • US09782540
    • 2001-02-12
    • Brian S. DoyleBrian RoberdsRafael Rios
    • Brian S. DoyleBrian RoberdsRafael Rios
    • H01L2701
    • H01L29/78621H01L29/78606H01L29/78696
    • An integrated circuit and method for making it are described. The integrated circuit includes a first insulating layer formed on a substrate and a body strap of a first conductivity type that is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer adjacent to the body strap and a film is formed on the second insulating layer. The integrated circuit also includes a gate electrode formed on the film. A plurality of doped regions of a second conductivity type are formed within the film that extend from the surface of the film to the surface of the second insulating layer. The doped regions have junctions that are each spaced from the body strap by at least about 500 angstroms.
    • 对集成电路及其制作方法进行说明。 集成电路包括形成在基板上的第一绝缘层和形成在第一绝缘层上的第一导电类型的主体带。 在与体带相邻的第一绝缘层上形成第二绝缘层,并且在第二绝缘层上形成膜。 集成电路还包括形成在膜上的栅电极。 在薄膜内形成多个第二导电类型的掺杂区,从薄膜的表面延伸到第二绝缘层的表面。 掺杂区域具有与体带相隔至少约500埃的交点。
    • 47. 发明申请
    • Multi-gate structure and method of doping same
    • 多栅极结构及掺杂方法
    • US20080237719A1
    • 2008-10-02
    • US11729198
    • 2007-03-28
    • Brian S. DoyleSuman DattaJack T. KavalierosRafael Rios
    • Brian S. DoyleSuman DattaJack T. KavalierosRafael Rios
    • H01L27/12H01L21/8238
    • H01L29/785H01L29/66795H01L29/66803
    • A multi-gate structure includes a substrate (110, 210, 410), an electrically insulating layer (120, 220, 420) over the substrate, and a first semiconducting fin (130, 230, 430) above the electrically insulating layer. The first semiconducting fin includes a top region (131, 231, 431), a first side region (132, 232, 432), and a second side region (133, 233, 433). The top region, the first side region, and the second side region have doping concentrations that are substantially equal to each other. The multi-gate structure may be made by depositing a solid source material (510) over the semiconducting fin, and by annealing the multi-gate structure such that dopants from the solid source material diffuse into the semiconducting fin and uniformly dope the top region and the first and second side regions.
    • 多栅极结构包括衬底(110,210,410),在衬底上方的电绝缘层(120,220,420)以及在电绝缘层上方的第一半导电翅片(130,230,430)。 第一半导体鳍片包括顶部区域(131,231,431),第一侧面区域(132,232,432)和第二侧面区域(133,233,433)。 顶部区域,第一侧面区域和第二侧面区域具有彼此基本相等的掺杂浓度。 多栅极结构可以通过在半导体鳍上沉积固体源材料(510)并且通过退火多栅极结构使得来自固体源材料的掺杂剂扩散到半导体翅片中并且均匀地掺杂顶部区域和 第一和第二侧区域。