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    • 6. 发明申请
    • METHODS OF FORMING A PHASE CHANGE MATERIAL
    • 形成相变材料的方法
    • US20120108037A1
    • 2012-05-03
    • US13347919
    • 2012-01-11
    • Keith R. Hampton
    • Keith R. Hampton
    • H01L21/365B82Y40/00
    • H01L45/1625C23C14/3414H01L45/06H01L45/1233H01L45/143H01L45/144H01L45/165
    • A phase change material including a high adhesion phase change material formed on a dielectric material and a low adhesion phase change material formed on the high adhesion phase change material. The high adhesion phase change material includes a greater amount of at least one of nitrogen and oxygen than the low adhesion phase change material. The phase change material is produced by forming a first chalcogenide compound material including an amount of at least one of nitrogen and oxygen on the dielectric material and forming a second chalcogenide compound including a lower percentage of at least one of nitrogen and oxygen on the first chalcogenide compound material. A phase change random access memory device, and a semiconductor structure are also disclosed.
    • 一种相变材料,包括形成在电介质材料上的高粘附相变材料和形成在高粘附相变材料上的低粘附相变材料。 高粘附相变材料包括比低粘附相变材料更大量的氮和氧中的至少一种。 相变材料通过在电介质材料上形成包含一定量的氮和氧的第一硫属化物化合物材料并在第一硫族化物上形成包含较低百分比的氮和氧的至少一种的第二硫族化合物 复合材料。 还公开了相变随机存取存储器件和半导体结构。
    • 10. 发明申请
    • TRANSPARENT CONDUCTIVE FILM DEPOSITION APPARATUS, FILM DEPOSITION APPARATUS FOR CONTINUOUS FORMATION OF MULTILAYERED TRANSPARENT CONDUCTIVE FILM, AND METHOD OF FORMING THE FILM
    • 透明导电膜沉积装置,用于连续形成多层透明导电膜的膜沉积装置及形成膜的方法
    • US20090203194A1
    • 2009-08-13
    • US11814527
    • 2006-01-20
    • Yoshiaki Tanaka
    • Yoshiaki Tanaka
    • H01L21/365C23C16/54
    • H01L31/1884C23C16/407C23C16/45572C23C16/45574C23C16/45578C23C16/54H01L21/02554H01L21/02576H01L21/0262Y02E10/541
    • Raw materials are economized and a film deposition rate is improved while maintaining film evenness and high film quality.A film deposition apparatus for the continuous formation of a multilayered transparent conductive film is provided which comprises a substrate attachment part, a charging part where evacuation is conducted, a multilayer deposition treatment part comprising two or more deposition treatment parts for forming a transparent conductive film on a substrate by the MOCVD method by reacting an organometallic compound (diethylzinc), diborane, and water in a vapor phase, a substrate takeout part, a substrate detachment part, and a setter return part where the substrate setter is returned to the substrate attachment part. Film deposition is successively conducted while moving a substrate sequentially through the parts to form a multilayered transparent conductive film on the substrate. Each deposition treatment part is equipped with nozzles for spraying the organometallic compound, diborane, and water and with a cooling mechanism for cooling the nozzles.
    • 节约原材料,提高成膜速度,同时保持膜的均匀性和高的膜质量。 提供一种用于连续形成多层透明导电膜的成膜装置,其包括:基板安装部,进行排气的充电部;多个沉积处理部,包括两个以上用于形成透明导电膜的沉积处理部 通过MOCVD方法通过气相中的有机金属化合物(二乙基锌),乙硼烷和水反应的底物,基板取出部分,基板分离部分和安装器返回部分,其中基板固定器返回到基板安装部分 。 在基板顺序移动基板的同时依次进行膜沉积,以在基板上形成多层透明导电膜。 每个沉积处理部分都装有用于喷洒有机金属化合物,乙硼烷和水的喷嘴以及用于冷却喷嘴的冷却机构。